Rapid pressureless low-temperature sintering of Ag nanoparticles for high-power density electronic packaging

Wang, Shuai; Li, Mingyu; Ji, Hongjun; Wang, Chunqing

doi:10.1016/j.scriptamat.2013.08.031

Cited by 154 publications

(38 citation statements)

References 21 publications

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“…The occurrence of twin boundaries in pressure-free sintering of Ag nanoparticles was recently predicted from molecular dynamics simulations [28] although the high density of twins observed in the present work suggests that simulations with small numbers of particles still do not fully capture the relevant stress relaxation mechanisms. Experimental observation of a high density of twin boundaries after pressure free Ag NP sintering at 200°C appears to show an even higher density of grain boundaries than observed in the present paper [29]. The TEM images also confirm absence of nano-scale pores in the material and that grain boundaries in the Ni layer lead to grain boundaries inside the Au layer and then into the sintered Ag.…”

Section: Au Substrate Microstructuresupporting

confidence: 71%

Microstructure evolution during 300 °C storage of sintered Ag nanoparticles on Ag and Au substrates

Paknejad¹,

Dumas²,

West³

et al. 2014

Journal of Alloys and Compounds

110

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Section: Au Substrate Microstructuresupporting

confidence: 71%

Microstructure evolution during 300 °C storage of sintered Ag nanoparticles on Ag and Au substrates

Paknejad¹,

Dumas²,

West³

et al. 2014

Journal of Alloys and Compounds

110

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“…In addition, several methods for the nanoscale welding of noble metals have been reported. For instance, ultrathin Au nanowires with a diameter of 5–10 nm, Au–Ag thin films, and Au nanoparticles were welded by a cold welding method; Ag nanowire junctions, Au particles, and Ag nanowires/carbon nanotubes were welded by plasmonic welding; and Ag nanowires and nanoparticles were welded by thermal and joule heating‐based welding. Further, room‐temperature chemical welding based on capillary condensation has also been demonstrated recently .…”

Section: Introductionmentioning

confidence: 99%

Shape‐Controlled 3D Periodic Metal Nanostructures Fabricated via Nanowelding

Zhao

Shin

Choi

et al. 2017

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A novel method for fabricating 3D metallic nanostructures to be used in polarized color filters based on nanoimprint lithography, electron-beam evaporation, and nanowelding is proposed. The shape of the nanostructures can be controlled by adjusting the temperature for the nanowelding process. Ag nanowires deposited on polymer patterns are accumulated by the nanowelding process to build up diverse 3D nanostructures. The morphologies of the fabricated 3D nanostructures are analyzed using scanning electron microscopy, atomic force microscopy, and focused ion beam; the heating temperature is varied from 90 to 130 °C in steps of 10 °C. In order to analyze the recrystallization phenomenon after welding, transmission electron microscopy is utilized. The 3D metallic nanostructure has different morphologies and optical properties corresponding to welding temperature conditions and accumulated layer thicknesses. Based on preliminary experimental results, the process parameters are optimized and a polarized color filter is fabricated. Optical characteristics of the filter are evaluated using polarizer and spectrometer. Through this work, it is shown that the proposed method is an effective way to realize various 3D metallic nanostructures for special optical properties, therefore the method based on nanowelding can be utilized in fabrication of functional metamaterials, optical filters, biosensors, and others.

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“…2019, 9, 3476 2 of 15 and highly reliable performance [3][4][5][6][7][8][9]. Although the traditional sintering process requires complicated pressure-assistance, optimized bonding materials for pressureless bonding have recently emerged as powerful alternatives [10][11][12][13]. However, high-cost and low compatibility with conventional soldering processes inhibit the industrial use of these materials.…”

Section: Introductionmentioning

confidence: 99%

Deformation Behavior of Transient Liquid-Phase Sintered Cu-Solder-Resin Microstructure for Die-Attach

et al. 2019

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We have proposed a low-temperature bonding technology utilizing the sintering of Cu particles with transient liquid-phase of Sn-based solder, called transient liquid-phase sintering (TLPS), as a die-attach solution for high-temperature power modules. A copper-intermetallic compound-resin (Cu-IMC-resin) microstructure, which consists of Cu particles connected with Cu–Sn intermetallic compounds (IMCs) partially filled with polyimide resin, is obtained by the pressureless TLPS process at 250 °C for 1 min using a novel Cu-solder-resin composite as the bonding material in a nitrogen atmosphere. Macro- and micro-deformation properties of the unique microstructure of the TLPS Cu-IMC-resin are evaluated by finite element analysis using a three-dimensional image reconstruction model. The macroscopic computational uniaxial tensile tests of the Cu-IMC-resin model reveal that the utilization of the IMCs and the addition of the easily-deformable resin facilitates the temperature-stability and low-stiffness of the mechanical properties. The microstructure exhibits a significantly low homogenized Young’s modulus (11 GPa). Microscopic investigations show that the local stresses are broadly distributed on the IMC regions under uniaxial macroscopic tensile displacement, indicating highly reliable performance of the joint within a specific macroscopic strain condition. Numerical and experimental investigations demonstrate the excellent thermal cyclic reliability of die-attached joints between silicon carbide chips and directly bonded copper substrate.

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Rapid pressureless low-temperature sintering of Ag nanoparticles for high-power density electronic packaging

Cited by 154 publications

References 21 publications

Microstructure evolution during 300 °C storage of sintered Ag nanoparticles on Ag and Au substrates

Microstructure evolution during 300 °C storage of sintered Ag nanoparticles on Ag and Au substrates

Shape‐Controlled 3D Periodic Metal Nanostructures Fabricated via Nanowelding

Deformation Behavior of Transient Liquid-Phase Sintered Cu-Solder-Resin Microstructure for Die-Attach

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