Reaction and nucleation mechanisms of copper electrodeposition from ammoniacal solutions on vitreous carbon

Grujicic, Darko; Pešić, Batrić

doi:10.1016/j.electacta.2005.02.012

Cited by 174 publications

(132 citation statements)

References 23 publications

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“…25,27 A linear relationship was found on a semilogarithmic plot of current density vs. time in Figure 4b) which suggests tin deposition onto copper proceeded through a rapid cluster nucleation with a subsequent diffusion-limited growth. The nucleation process of tin onto copper was analysed using data from the rising part of the experimental current transient curve compared with dimensionless theoretical curves for both instantaneous and progressive nucleation according to the Scharifker-Hills equations [27][28][29][30][31][32] in Figure 4c). …”

Section: Nucleation and Growth Of Tin On Coppermentioning

confidence: 99%

A review of developments in the electrodeposition of tin

Walsh

Low

2016

Surface and Coatings Technology

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Highlights Types of aqueous electrolytes for pure tin deposits are reviewed. The many existing and developing applications of tin deposits are summarised. Emphasis is placed on versatile methanesulfonic acid electrolytes. The effects of bath composition (including additives) and operating conditions on deposit morphology are illustrated. Electrochemical studies at static and controlled flow rotating electrodes are illustrated. AbstractThe importance of tin and its electrodeposition are summarised and the scope for plating tin is outlined.Established applications of electroplated tin include corrosion protection, electronics fabrication and cooking utensils. The past 20 years have seen developments in the science and technology of tin plating, including research into nanostructured deposits, adoption of environmentally friendly methanesulfonic acid baths and more ambitious coatings including multi-layers and composites. Our ability to tailor deposit structure and composition has been improved by newer electrolytes, pulse plating and electrolyte additives. The diversity of tin applications has extended to lithium batteries using newer structures (such as composites, multi-layers and nanostructures), electrical control (e.g., pulsed current) and relative bath/electrode movement (including the use of rotating electrodes). Electrochemical aspects of modern tin deposition are illustrated by data from the authors' laboratory which highlights the versatility of methanesulfonic acid electrolytes. A wide range of deposit morphology, colour and surface finish are possible by the use of suitable addition agents and control of electrode/electrolyte movement and operating conditions. Subject areas needing further research work are identified.

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Section: Nucleation and Growth Of Tin On Coppermentioning

confidence: 99%

A review of developments in the electrodeposition of tin

Walsh

Low

2016

Surface and Coatings Technology

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“…Based on thermodynamic and electrochemical studies, numerous authors agree that the electrodeposition of copper from ammoniacal solutions of different compositions occurs via the reduction of cupric tetrammine to cuprous diammine, which is then further reduced to metallic copper (Darchen et al, 1997;Giannopoulou et al, 2009;Graham et al, 2002;Grujicic and Pesic, 2005;Nila and González, 1996a;Nila and González, 1996b;Ramos et al, 2001;Vazquez-Arenas et al, 2007a;Vazquez-Arenas et al, 2007b). The direct reduction of cupric tetrammine to metallic copper is also thought to take place at more negative applied potentials (Grujicic and Pesic, 2005). In addition, Grujicic states that the anodic dissolution of metallic copper in ammoniacal solution occurs as a two electron oxidation process to cupric tetrammine, which could be the case when the oxidant is dissolved oxygen and no cupric tetrammine is present in the solution.…”

Section: Introductionmentioning

confidence: 99%

The passivation of iron in ammoniacal solutions containing copper (II) ions

D'Aloya

Nikoloski

2012

Hydrometallurgy

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In the present study it was found that the presence of millimolar amounts of copper (II) ions in ammoniacal solutions leads to the spontaneous formation of a stable passive layer on metallic iron and iron alloys with nickel and cobalt, under conditions in which they would otherwise remain in active dissolution. This finding may be of significance to industrial processes which employ ammoniacal solutions to leach metal values from materials rich in metallic iron, such as, for example, laterite ores which have undergone a reductive pre-treatment.The spontaneous passivation is found to take place regardless of the presence or practical absence of dissolved oxygen, and occurs more readily the higher the copper concentration and the lower the ammonia-ammonium bicarbonate concentration, though it does not take place in ammonia-free aqueous solutions of similar copper (II) ion concentrations.Electrochemical and scanning electron microscopy / energy dispersive X-ray spectroscopy (SEM/EDX) investigations conducted as part of this study showed that the observed passivation is promoted by the cementation of copper onto the actively dissolving iron surface, and subsequently by its re-dissolution. Such process is thought to create favourable conditions which promote the formation of a stable passive layer on the iron surface.

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“…Para avaliar a influência do processo de adsorção, foram usadas duas soluções de 10 -3 mol L -1 de CuSO 4 42 A corrente catódica inicial atribuída ao processo Ic foi associada à redução de íons Cu 2+ a íons Cu + de acordo com a reação 2:…”

Section: Eletrodeposição De Nps-cu Sobre Eletrodos De Ddbunclassified

Influência do eletrólito na eletrodeposição de nanopartículas de Cu sobre eletrodo de diamante dopado com boro

Matsushima¹,

Santos²,

Couto³

et al. 2012

Quím. Nova

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Recebido em 21/9/10; aceito em 12/5/11; publicado na web em 4/7/11 ELECTROLYTE INFLUENCE ON THE Cu NANOPARTICLES ELECTRODEPOSITION ONTO BORON DOPED DIAMOND ELECTRODE. This paper presents the electrolyte influence on deposition and dissolution processes of Cu nanoparticles on boron doped diamond electrodes (BDD). Morphological, structural and electrochemical analysis showed BDD films with good reproducibility, quality and reversible in a specific redox system. Electrodeposition of Cu nanoparticles on DDB electrodes in three different solutions was influenced by pH and ionic strength of the electrolytic medium. Analyzing the process as function of the scan rate, it was verified a better efficiency in 0,5 mol L -1 Na 2 SO 4 solution. Under the influence of the pH and ionic strength, Cu nanoparticles on DDB may be obtained with different morphologies and it was important for defining the desired properties.Keywords: Cu nanoparticles; electrodeposition; boron doped diamond films. INTRODUÇÃONos últimos anos, o interesse por eletrodos modificados com nanopartículas (NPs) tem aumentado, consideravelmente, devido as suas propriedades físico-químicas bastante específicas que podem ser exibidas na escala nanométrica, mas que não são típicas dos materiais bulk correspondentes. 1 Na área eletroquími-ca, particularmente, em eletroanálise, NPs têm sido amplamente utilizadas como nanomatérias funcionais de superfície. Dentre alguns artigos excelentes de revisão publicados na literatura, [2][3][4][5][6] Welch e Compton destacam quatro principais vantagens quanto ao uso de eletrodos modificados com NPs aplicadas em eletroanálise: elevada área superficial efetiva, aumento do transporte de massa, atividade catalítica e controle sobre o microambiente local. 2 Em uma visão mais detalhada, a deposição de NPs resulta em um aumento da rugosidade superficial, que contribui para o aumento da área condutora do eletrodo modificado. Esta condição favorece a cinética de transferência de elétrons reduzindo o sobrepotencial para a ocorrência das reações eletroquímicas. Ao mesmo tempo, a redução do sobrepotencial aumenta a seletividade em uma análise eletroquímica, a qual permite a aplicação de potenciais de operação mais baixos, reduzindo ou mesmo eliminando a possibilidade dos potenciais de eletrólise de outras espécies presentes serem atingidos.Alguns metais, como platina, ouro e prata, têm sido comumente usados como NPs na modificação de eletrodos. Em razão da vasta aplicação eletroanalítica desses nanomateriais, outros metais, tais como paládio, rutênio, cobre e níquel vêm despertando interesse para tal propósito. 6 Entretanto, os resultados esperados são alcançados quando se tem um controle das características físico-químicas do substrato modificado. De forma geral, os substratos comumente usados para a caracterização eletroquímica de NPs estão sujeitos à corrosão (no caso do grafite e carbono vítreo) ou mesmo à formação de óxidos (no caso do titânio e ouro) em elevados potenciais anódi-cos. Estes acontecimentos podem modificar diretamente...

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Reaction and nucleation mechanisms of copper electrodeposition from ammoniacal solutions on vitreous carbon

Cited by 174 publications

References 23 publications

A review of developments in the electrodeposition of tin

A review of developments in the electrodeposition of tin

The passivation of iron in ammoniacal solutions containing copper (II) ions

Influência do eletrólito na eletrodeposição de nanopartículas de Cu sobre eletrodo de diamante dopado com boro

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