Reaction kinetics of Ni/Sn soldering reaction

Görlich, J.; Baither, D.; Schmitz, Guido

doi:10.1016/j.actamat.2010.01.027

Cited by 66 publications

(21 citation statements)

References 27 publications

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“…The diffusion-controlled supply of Ni atoms through the IMC layer will certainly proceed faster at 573 K (300°C) compared to 523 K (250°C), which is reflected by the faster kinetics observed at 300°C for annealing times longer than 3 minutes. The kinetic observations in the present study are consistent with the work of Go¨rlich et al, [20] in which a transition toward slower growth kinetics was also identified after a 3-min near-isothermal holding time. Van Beek et al [28] claimed that Sn is the faster diffusing element through Ni 3 Sn 4 IMC, whereas Reference 31 determined a diffusion coefficient for Ni into Ni 3 Sn 4 that was twice as high as that for Sn into Ni 3 Sn 4 .…”

Section: A Morphological Evolution Of Ni 3 Sn 4 Imcsupporting

confidence: 94%

“…[11,25,26] By contrast, the formation of faceted Ni 3 Sn 4 IMC has been monitored in various studies. [19,20,22,23] Generally, a phase facets when it is difficult for atoms to attach from the liquid state to a nucleated solid layer. Jackson and Hunt [24] developed a theory on the solidification from the melt, in which they introduced the Jackson parameter a as…”

Section: A Morphological Evolution Of Ni 3 Sn 4 Imcmentioning

confidence: 99%

“…The IMC scallops observed at 773 K (500°C) were shown to transform into elongated faceted grains at lower temperatures of 673 K and 623 K (400°C and 350°C). In a different approach, Go¨rlich et al [20] assessed early-stage IMC formation by placing molten Sn droplets on a hot Ni plate at 250°C. They obtained near-isothermal experimental conditions, which were tracked from 30 seconds to 7 days of holding time.…”

Section: Introductionmentioning

confidence: 99%

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Characteristics of Reactive Ni3Sn4 Formation and Growth in Ni-Sn Interlayer Systems

Lis

Kenel

Leinenbach

2016

Metall Mater Trans A

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The near-isothermal growth and formation of Ni 3 Sn 4 intermetallic compounds (IMC) in Ni-Sn interlayer systems was studied in the solid state at 473 K (200°C) and under solid-liquid conditions at 523 and 573 K (250°C and 300°C) from an initial state of a few seconds. Scalloped solid-state IMC formation was mainly driven by grain boundary diffusion of Ni through the IMC layer combined with the grain coarsening of the IMC layer. Under solid-liquid conditions, the formation of faceted and needle-shaped Ni 3 Sn 4 grains as well as an atypical IMC growth behavior with similar parabolic growth constants for 523 K and 573 K (250°C and 300°C) was observed within the first 180 seconds of the holding time, and IMC growth occurred as an isothermal solidification from the Ni-saturated Sn melt. Due to the progressive densification of the IMC layer and the diffusion-controlled growth, the kinetics slowed down by approximately one order of magnitude after 180 seconds of annealing. The final stage was characterized by the formation of IMC islands ahead of the interfacial Ni 3 Sn 4 layer. Needle-like IMC growth was effectively suppressed under combined solid-state and solid-liquid conditions. Textured Ni 3 Sn 4 IMC formation at the Ni-Sn interface was approved with pole figure measurements. The activation energy Q for solid-liquid IMC formation was calculated as 43.3 kJ/mol, and processing maps for IMC growth and Sn consumption were derived as functions of temperature and time, respectively.

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Section: A Morphological Evolution Of Ni 3 Sn 4 Imcsupporting

confidence: 94%

Section: A Morphological Evolution Of Ni 3 Sn 4 Imcmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Characteristics of Reactive Ni3Sn4 Formation and Growth in Ni-Sn Interlayer Systems

Lis

Kenel

Leinenbach

2016

Metall Mater Trans A

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“…Solder reactions in the Sn/Ni and Sn-Ag/Ni systems and subsequent microstructure evolution have been widely studied [2][3][4][5][6][7][8][9][10][11][12][13][14][15] and most researchers reported Ni3Sn4 as the major interfacial reaction product in such systems, similar to that shown in Figure 1A. At the same time, it is known that non-equilibrium Sn-Ni intermetallics can form in Sn-Ni couples after soldering or during storage at elevated temperatures.…”

Section: Introductionmentioning

confidence: 64%

The Influence of Cu on Metastable NiSn4 in Sn-3.5Ag-xCu/ENIG Joints

Belyakov

Gourlay

2015

Journal of Elec Materi

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We explore the effect of dilute Cu additions on the suppression of metastable βSn-NiSn4 eutectic growth in solder joints between Sn-3.5Ag-xCu solders and Ni-based substrates.In Sn-3.5Ag/electroless nickel immersion gold (ENIG) or Sn-3.5Ag/Ni solder joints, it is shown that the eutectic mixture contains Sn, Ag3Sn and metastable NiSn4. It is found that additions of only 0.005wt%Cu to Sn-3.5Ag-xCu/ENIG or Sn-3.5Ag-xCu/Ni joints promote the formation of stable βSn-Ni3Sn4 eutectic and that both Ni3Sn4 and NiSn4 exist in the eutectic at this Cu level. It is further shown that for the full prevention of metastable NiSn4 during eutectic solidification of the solder joint, more considerable Cu additions of at least 0.3wt%Cu are required.Keywords: Microstructure, Pb-free soldering, Metastable, NiSn4, Intermetallics, Solidification INTRODUCTIONSn-Ag solders are a popular choice for consumer and power electronics [1] and the composition is frequently used on Ni-containing surface finishes, such as electroless nickel immersion gold (ENIG) and electroless nickel, electroless palladium immersion gold (ENEPIG), and on Ni-based UBMs (underbump metallizations). Solder reactions in the Sn/Ni and Sn-Ag/Ni systems and subsequent microstructure evolution have been widely studied [2][3][4][5][6][7][8][9][10][11][12][13][14][15] and most researchers reported Ni3Sn4 as the major interfacial reaction product in such systems, similar to that shown in Figure 1A. At the same time, it is known that non-equilibrium Sn-Ni intermetallics can form in Sn-Ni couples after soldering or during storage at elevated temperatures. In most cases non-equilibrium Sn-Ni compounds such as Ni3Sn8 [16], and NiSn4 [22][23][24] were found after solid state ageing or thermal cycling [16][17][18][19][21][22][23][24] or after heat treatments combined with electric current passage through the joint [19,22]. Figure 2A is an example of non-equilibrium NiSn4 formed at the interface during solid Figure 2B). In contrast, when soldered to Alloy42, the FeSn2 interfacial intermetallic layer serves as an efficient diffusion barrier limiting the amount of Ni that dissolves into the liquid solder during reflow [28,29].As result, this type of solder joints has less NiSn4 in the bulk solder than on Ni or ENIG substrates( Figure 2D). We have also found that trace Fe additions promote metastable NiSn4 formation due to epitaxial nucleation of NiSn4 on FeSn2 particles [30].We have recently demonstrated [27] that industrially important Sn-3.5Ag/ENIG or Sn-3.5Ag/Ni joints also solidify to contain metastable Sn-NiSn4 eutectic ( Figure 2A-C, E). Surprisingly, despite the fact that Sn-Ag solders have been used on Ni-containing substrates for decades, this phenomenon was missed in past research. NiSn4 is a metastable phase and can transform into equilibrium Ni3Sn4 and βSn whilst the solder joint is in service at elevated temperatures [25,27]. In automotive and power electronics, operation temperatures are relatively high (175-200°C) and microstructural stability and reliabil...

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“…The failure of solder joints often occurs at the interface between the IMC and solder or between the IMC and metallic substrate, and consequently leads to loss of function in interconnects and results in product failure. So far, there has been increasing attention towards the study of formation, growth and morphology evolution of interfacial IMC phases in lead-free solder joints by experimental characterization and numerical simulation [7][8][9][10][11][12][13][14][15]. According to the thermodynamics theory [8], at the initial stage of the metallic substrate (such as Cu or Ni) contacting to the molten solder, the metallic atoms rapidly dissolve into the molten solder and quickly become supersaturated in the interface regions; and subsequently the IMC phases start to nucleate and grow at the interface due to the local metastable equilibrium solubility of metallic atoms in the liquid solder alloy.…”

Section: Introductionmentioning

confidence: 99%

Premelting behavior and interfacial reaction of the Sn/Cu and Sn/Ag soldering systems during the reflow process

Zhou

Zhang

2012

J Mater Sci: Mater Electron

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The early interfacial reaction and premelting characteristics of the Sn/Cu and Sn/Ag soldering systems, and the formation and morphology transition of interfacial intermetallic compounds in the two systems during the reflow soldering process were investigated by using a differential scanning calorimeter. Results show that the initial interfacial eutectic reaction arising from atomic interdiffusion in solid-state Sn/Cu and Sn/Ag systems results in the premelting at each interface of the two systems at a temperature 4.9 and 10.6°C respectively lower than the actual melting point of pure tin, and consequently both of the Sn/Cu and Sn/Ag soldering systems exhibit morphology change of the intermetallic compound (IMC) as the solder experiences a transition from solid-state to liquid-state in a very small temperature range. The change in the interfacial energy between the solid (or liquid) Sn-rich phase and IMC phase is the essential factor leading to the morphology transition of the interfacial IMC in the Sn/Cu and Sn/Ag soldering systems.

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Reaction kinetics of Ni/Sn soldering reaction

Cited by 66 publications

References 27 publications

Characteristics of Reactive Ni3Sn4 Formation and Growth in Ni-Sn Interlayer Systems

Characteristics of Reactive Ni3Sn4 Formation and Growth in Ni-Sn Interlayer Systems

The Influence of Cu on Metastable NiSn4 in Sn-3.5Ag-xCu/ENIG Joints

Premelting behavior and interfacial reaction of the Sn/Cu and Sn/Ag soldering systems during the reflow process

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