The effect of solute segregation on strain localization in nanocrystalline thin films: Dislocation glide vs. grainboundary mediated plasticity Lattice and grain-boundary diffusions of boron atoms in BaSi2 epitaxial films on Si(111) J. Appl. Phys. 113, 053511 (2013); 10.1063/1.4790597
Effect of Cu and Ag solute segregation on βSn grain boundary diffusivityThe diffusion coefficient of As in 260 nm thick polycrystalline Ni 2 Si layers has been measured both in grains and in grain boundaries ͑GBs͒. As was implanted in Ni 2 Si layers prepared via the reaction between a Si layer and a Ni layer deposited by magnetron sputtering on a ͑100͒ Si substrate covered with a SiO 2 film. The As concentration profiles in the samples were measured using secondary ion mass spectroscopy before and after annealing ͑400-700°C͒. The diffusion coefficients in the grains and the GBs have been determined using two-dimensional finite element simulations based on the Fisher model geometry. For short time annealing ͑1 h͒ and temperatures lower than 600°C, lattice diffusion has not been observed. However, GB diffusion was evidenced for temperatures as low as 400°C. For higher thermal budgets, As diffuses simultaneously in the volume of the grains and in the GBs. Lattice diffusion is characterized by a pre-exponential factor D 0v ϳ 1.5 ϫ 10 −1 cm 2 s −1 and an activation energy Q v ϳ 2.72Ϯ 0.10 eV. In the case of GB diffusion, the triple product of the As segregation coefficient ͑s͒, the GB width ͑␦͒, and the diffusion coefficient ͑D GB ͒ is found to be s␦D GB = 9.0ϫ 10 −3 exp͑−3.07Ϯ 0.15 eV/ kT͒ cm 3 s −1 . Various types of simulations were used in order to support the discussion of the results.