Recent advances in high-power VCSEL arrays

Wang, Chad S.; Geske, J.; Berdin, Glen; Talantov, Fedor; Cardellino, Terri; Garrett, Henry E.; Millenheft, David; Kumsomboone, Victor; Renner, Daniel

doi:10.1109/phosst.2012.6280696

Cited by 1 publication

(2 citation statements)

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“…Dashed lines in Figure (d) illustrate peak shifts derived from 3D finite element analysis of thermal dissipation in printed micro‐VCSELs, which are very close to the values obtained from experiments. The calculated elevation of temperature in the active region of micro‐VCSELs was converted to the change of a specific lasing mode using previously‐reported temperature dependence (dλ/dT ∼0.07 nm/K) for 850 nm VCSELs . Figure (e) displays contour plots of steady‐state temperature distribution of a printed micro‐VCSEL on various substrates, in which it is evidently shown that the effectiveness of heat spreading and release from the micro‐VCSEL that serves as a point heat source is substantially different depending on the thermal conductivity of substrates.…”

Section: Resultsmentioning

confidence: 99%

“…Since they were first developed in 1979, vertical cavity surface emitting lasers (VCSELs), a type of semiconductor diode lasers based on epitaxially grown compound semiconductors, have made a significant contribution to the advancement of various important technological applications in areas including optical communication, data scanning and sensing, infrared illumination, laser printing, and others . More recently, VCSELs have been also rapidly emerging as a coherent excitation light source for biomedical detection and imaging .…”

Section: Introductionmentioning

confidence: 99%

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Compliant, Heterogeneously Integrated GaAs Micro‐VCSELs towards Wearable and Implantable Integrated Optoelectronics Platforms

Kang

Lee

et al. 2014

Advanced Optical Materials

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optical communication, [ 2,3 ] data scanning and sensing, [ 4,5 ] infrared illumination, [ 6,7 ] laser printing, [ 8,9 ] and others. [ 10,11 ] More recently, VCSELs have been also rapidly emerging as a coherent excitation light source for biomedical detection and imaging. [ 12,13 ] Despite such increasingly versatile utilities, established modes of exploiting VCSELs have been intrinsically limited as they rely mainly on devices that operate on their native growth substrates, which is attributed to diffi culties in materials growth, processing, and assembly methods that are not readily compatible with programmable distribution on unusual substrates over large area, as well as heterogeneous integration with dissimilar materials and devices. [ 14,15 ] Furthermore, VCSELs, typically built on rigid and brittle semiconductor wafers, restricted their capacity to integrate effectively onto systems with a soft, non-planar interface, which can be extremely useful for many unconventional applications. [ 16,17 ] Whereas a number of different approaches such as fl ip-chip integration, [ 18,19 ] wafer bonding, [20][21][22] fl uidic assembly, [ 23,24 ] epitaxial lift-off (ELO), [ 25,26 ] and appliqué [ 14,27,28 ] have been developed for integrating VCSELs on non-native substrates with their own advantages, none of them are suitable for commercial implementation and for achieving systems that satisfy all of above-described features due to many diffi cult and persistent challenges including little or no control over areal coverage and spatial layout, compromised performance during the fabrication and assembly (e.g., etching or wafer bonding), poor cost-effectiveness and low throughput, as well as limited choices of substrate materials. Although the conventional ELO process has been successfully used for solar cells and other optoelectronic devices in the past decades, [ 16,[29][30][31][32] its application to VCSELs remained great challenges owing to signifi cant damages in active materials such as mirror layers and quantum wells during the sacrifi cial removal of AlAs, and resulting strongly deteriorated device performance. Furthermore, all of aforementioned approaches are lack of capabilities to manipulate individual or selective sets of microscale VCSELs with customizable device layouts to meet specifi c requirements of applications. Here we present an approach to overcome all of Vertical cavity surface emitting lasers (VCSELs) represent a ubiquitous light source with unique performance characteristics that excel for edge-emitting lasers or light-emitting diodes. VCSELs are available, however, mostly on growth wafers in rigid, planar formats over restricted areas, thereby frustrating their use for applications that benefi t greatly from unconventional design options including large-scale, programmable assemblies on unusual substrates, hybrid integration with dissimilar materials and devices, or mechanically compliant constructions. Here, materials design and fabrication strategies are presented to overcome these limitations of ...

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Section: Resultsmentioning

confidence: 99%