Recent Developments on Epoxy-Based Thermally Conductive Adhesives (TCA): A Review

Singh, Amit Kumar; Panda, Bishnu P.; Mohanty, Smita; Nayak, Sanjay K.; Gupta, Manoj

doi:10.1080/03602559.2017.1354253

Cited by 37 publications

(12 citation statements)

References 152 publications

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“…The present FRPs are sustainable [107] in terms of time and energy consumption in comparison with conventional steel/concrete materials. However, further studies are needed to develop a new generation of green FRP bridges using natural fibers (such as flax, hemp, jute, or wood) and thermoplastic resins.…”

Section: Materials and Manufacturing Methods Of Frp Bridges' Componentsmentioning

confidence: 98%

Fiber reinforced polymer composites in bridge industry

et al. 2021

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Section: Materials and Manufacturing Methods Of Frp Bridges' Componentsmentioning

confidence: 98%

Fiber reinforced polymer composites in bridge industry

et al. 2021

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“…The development of technology put forward functional requirements for adhesive materials, such as adhesives with thermal conductivity [23][24][25][26], wave absorption [27], and electromagnetic shielding properties [28,29]. Researchers developed a series of functional adhesives to meet the needs of different fields [30]. In addition to the ability of transferring large loads, the thermally conductive structural adhesives also transfer heat quickly within the structural parts, which keeps the heat evenly distributed in the bonded joints while dissipating heat to reduce thermal stress and improve the safety, reliability, and service life of the bonded structural parts.…”

Section: Introductionmentioning

confidence: 99%

Environmental Resistance and Fatigue Behaviors of Epoxy/Nano-Boron Nitride Thermally Conductive Structural Film Adhesive Toughened by Polyphenoxy

et al. 2021

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The thermally conductive structural film adhesive not only carries large loads but also exhibits excellent heat-transfer performance, which has huge application prospects. Herein, a novel epoxy (Ep) thermally conductive structural film adhesive was prepared using polyphenoxy (PHO) as the toughening agent and film former, boron nitride (BN) nanosheets as the thermally conductive filler, and polyester fabric as the carrier. When the amount of PHO in the epoxy matrix was 30 phr and the content of nano-BN was 30 wt.% (Ep/PHO30/nBN30), the adhesive resin system showed good film-forming properties, thermal stability, and thermal conductivity. The glass transition temperature of Ep/PHO30/nBN30 was 215 °C, and the thermal conductivity was 209.5% higher than that of the pure epoxy resin. The Ep/PHO30/nBN30 film adhesive possessed excellent adhesion and peeling properties, and the double-lap shear strength at room temperature reached 36.69 MPa, which was 21.3% higher than that of pure epoxy resin. The double-lap shear strength reached 15.41 MPa at 150 °C, demonstrating excellent high temperature resistance. In addition, the Ep/PHO30/nBN30 film adhesive exhibited excellent heat-aging resistance, humidity, and medium resistance, and the shear strength retention rate after exposure to the complicated environment reached more than 90%. The structural film adhesive prepared showed excellent fatigue resistance in the dynamic load fatigue test, the double-lap shear strength still reached 35.55 MPa after 1,000,000 fatigue cycles, and the strength retention rate was 96.9%, showing excellent durability and fatigue resistance.

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“…Electrically conductive adhesives (ECAs) and lead-free solders were considered as promising alternatives of SnPb solders. ECAs, mainly composed of matrix polymer and conductive fillers, offer numerous advantages such as environmental friendliness, lower processing temperature, and fine pitch capability [3]. However, the application of ECAs is limited due to its lower thermal conductivity 2 of 20 and electrical conductivity, poor mechanical properties, and low reliability [4].…”

Section: Introductionmentioning

confidence: 99%

Effect of Nanoparticles Addition on the Microstructure and Properties of Lead-Free Solders: A Review

et al. 2019

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With the development of microelectronic packaging and increasingly specific service environment of solder joints, much stricter requirements have been placed on the properties of lead-free solders. On account of small size effect and high surface energy, nanoparticles have been widely used to improve the microstructure and properties of lead-free solders. Therefore, the composite solders bearing nanoparticles have recently attracted wide attention. This article reviewed the recent research on SnAgCu, SnBi, and SnZn composite solder alloys and introduced the effect of nanoparticles on their microstructure, mechanical properties, wettability, and reliability. The mechanism of nanoparticles strengthening was analyzed and summarized. In addition, the shortcomings and future development trends of nanoparticle-reinforced lead-free solders were discussed, which is expected to provide some theoretical reference for the application of these composite solder in 3D IC package.

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Recent Developments on Epoxy-Based Thermally Conductive Adhesives (TCA): A Review

Cited by 37 publications

References 152 publications

Fiber reinforced polymer composites in bridge industry

Fiber reinforced polymer composites in bridge industry

Environmental Resistance and Fatigue Behaviors of Epoxy/Nano-Boron Nitride Thermally Conductive Structural Film Adhesive Toughened by Polyphenoxy

Effect of Nanoparticles Addition on the Microstructure and Properties of Lead-Free Solders: A Review

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