2003
DOI: 10.1116/1.1580842
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Rectifying characteristics of sputter-deposited SiGe diodes

Abstract: Schottky and pn junction diodes with good rectifying characteristics have been prepared based on the polycrystalline SiGe (poly-SiGe) thin film deposited by the ion-beam-sputtering (IBS) technique. Boron and phosphorus diffusion techniques have been used to dope and crystallize as-deposited amorphous SiGe film. Rectification ratios as high as 4000 and 1800 have been achieved in Pt/n-poly-SiGe and Ti/p-poly-SiGe Schottky diodes, respectively, while rectification ratio higher than 1500 and breakdown voltage high… Show more

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Cited by 8 publications
(2 citation statements)
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“…To our knowledge, little work has been done on metal/poly-SiGe contacts properties so far. Recently, we demonstrated excellent rectifying characteristics of Pt and Ti on poly-Si 0.8 Ge 0.2 without annealing treatment [12]. However, in many potential application cases, the contact properties of an annealed structure are more important than those of an unannealed structure.…”
Section: Introductionmentioning
confidence: 97%
“…To our knowledge, little work has been done on metal/poly-SiGe contacts properties so far. Recently, we demonstrated excellent rectifying characteristics of Pt and Ti on poly-Si 0.8 Ge 0.2 without annealing treatment [12]. However, in many potential application cases, the contact properties of an annealed structure are more important than those of an unannealed structure.…”
Section: Introductionmentioning
confidence: 97%
“…In the TFT case, the device electrical performance may be also improved if the barrier height between the silicide source and poly-Si channel is reduced. Even though the knowledge about the Schottky barrier of silicide/poly-Si contacts is lack, it is expected that silicide on poly-Si has similar barrier height as that on single crystalline Si [14]. We recently developed a simplified low temperature SSDT process on single crystalline Si using self-aligned PtSi (for PMOS) and DySi 2Àx (for NMOS) S/D, HfO 2 gate dielectric and TaN/HfN metal gate electrode [15].…”
Section: Introductionmentioning
confidence: 98%