Gate oxide tunneling current I gate and sub-threshold current I sub dominate the leakage of designs. The latter depends on threshold voltage V th while I gate vary with the thickness of gate oxide layer T ox . In this paper, we propose a new method that combines approaches of Dual Threshold CMOS (DTCMOS), mixed-T ox CMOS, and pin-reordering. As the reduction of leakage leads to an increase of gate delay, our purpose is the reduction of total leakage at constant design performance. We modified a given technology and developed a library with a new mixed gate type. Compared to the case where all devices are set to high performance, our approach achieves an average leakage reduction of 65%, whereas design performance stays constant.