Reduction of out-of-plane warpage in surface micromachined beams using corrugation

Gupta, Arun Kumar; Barron, Lance; Brainin, Michael; Lee, Jeong

doi:10.1088/0960-1317/24/6/065023

Cited by 14 publications

(5 citation statements)

References 14 publications

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“…However, the deflection of the crenellated IPMC actuator deteriorates when the separation distance, I D , is increased to 0.7 cm. The likely cause of this deterioration is due to the force produced by the ionic movement in the crenellated IPMC actuator that fails to overcome the intrinsic stress that is induced in the electrode layer [20]. To prove this hypothesis, the von Mises stress of the electrode layer at the crenellated IPMC actuators for the respective crenellate ratios are studied and shown in supplementary figure S1.…”

Section: Design and Working Principlementioning

confidence: 99%

“…Moreover, to fit with the MEMS applications, it is also often easier to simply use a stacked Nafion membrane to increase the IPMC thickness and to enhance the force generation [19]. The thickening of the Nafion membrane, nonetheless, can deleteriously increase the bending stiffness (loss flexibility), which in turn sacrifices the actuator's displacement range, and this may affect its mechanical frequency responses [20]. Therefore, it is highly desirable to develop a new approach that can be used to address the trade-offs between the IPMC's blocking force and its displacement.…”

Section: Introductionmentioning

confidence: 99%

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A novel crenellated ionic polymer-metal composite (IPMC) actuator with enhanced electromechanical performances

Chang

Chee

Lim

et al. 2019

Smart Mater. Struct.

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Ionic polymer-metal composite (IPMC) is a promising biomimetic actuator that has received significant attention due to its remarkable high-strain electromechanical performances under low stimulated voltage. Most importantly, it is able to operate in aqueous environment. Nonetheless, the actuation force of the IPMC deteriorates when the applied strain gets too large, which has limited its applications practically. This work has introduced a novel approach that can be used to design crenellated structure on an IPMC actuator for improving its mechanical strength. Numerical simulation has been conducted to optimize the crenellate ratio for achieving larger blocking force and tip deflection. Experimental data has confirmed that the IPMC with the crenellate ratio of 2:3 can improve the blocking force as much as ∼70% and the tip deflection for at least 360%, being much better than the non-crenellated IPMC structure. Dynamic tests were performed at 1 Hz frequency to validate the actuator's operation in water and air media. The newly proposed crenellated structure can improve the IPMC performances significantly, and it will surely broaden the range of possible applications of the IPMC actuator.

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Section: Design and Working Principlementioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

A novel crenellated ionic polymer-metal composite (IPMC) actuator with enhanced electromechanical performances

Chang

Chee

Lim

et al. 2019

Smart Mater. Struct.

View full text Add to dashboard Cite

show abstract

“…Pachamuthu M and Jaisankar R [13] have discussed the construction methodology of lattice designs using MOLS using Galois feld. Gupta et al [14] have proved the reduction of out-of-plane warpage in surface micromachined beams using corrugation. Federer and Wright [15] have constructed the lattice square designs.…”

Section: Introductionmentioning

confidence: 99%

An Optimisation Method of Construction for Warping Copper Plates and Engines Using Complete Block Designs with Some Special Types of Graphs

Karthikeyan¹,

Kalaiselvi²,

Pachamuthu

et al. 2023

Advances in Materials Science and Engineering

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The application of bipartite and regular graphs plays a vital role in the area of engineering, mathematical sciences, design of experiments, and medical fields. This study proposes an optimization method for constriction of randomized block design and Latin square design using bipartite and regular graphs with applications of warping copper plates in specimens and comparing them to burners and engines on different days. The construction methods and analysis are performed as follows: the first method is a construction of randomized block design using bipartite and complete bipartite graphs with applications for the amount of warping copper plates and different laboratories are taken to test any significant difference that exists between the mean number of responses for the labs and copper specimens. The second method is the construction of a Latin square design using regular graphs to test whether there is any significant difference between the burners, engines, and some days in statistical analysis of interaction plots, contour plots, and 3D surface plots.

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“…The warpage problem induces fatal interconnection defects and initiates the weak connection between silicon chips and printed-circuit-board (PCB) by causing the misalignment, non-wet and contact area decrease when silicon chip is mounted on the packaging board [6,7]. Also, the vertical warping and curling of structures in the surface micromachining leads to degradation of functionality of micro-devices [8]. Therefore, a systematic basic study of the warpage of packaging substrate is necessary in order to analyze the warpage behavior mechanism and solve the warpage issues.…”

Section: Introductionmentioning

confidence: 99%

Warpage Analysis of Electroplated Cu Films on Fiber-Reinforced Polymer Packaging Substrates

et al. 2015

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This paper presents a warpage analysis method that predicts the warpage behavior of electroplated Cu films on glass fiber-reinforced polymer (GFRP) packaging substrates. The analysis method is performed using the following sequence: fabricate specimens for scanning 3D contours, transform 3D data into curvatures, compute the built-in stress of the film using a stress-curvature analytic model, and verify it through comparisons of the finite element method (FEM) simulations with the measured data. The curvature is used to describe the deflection and warpage modes and orientations of the specimen. Two primary factors that affect the warpage behavior of the electroplated Cu film on FRP substrate specimens are investigated. The first factor is the built-in stress in a Cu film that explains the room temperature warpage of the specimen under no thermal process. The second factor is the misfit of the coefficient of thermal expansion (CTE) between the Cu and FRP layer, which is a dominant factor during the temperature change. The calculated residual stress, and predicted curvatures using FEM simulation throughout the reflow process temperature range between 25 and 180 °C are proven to be accurate by the comparison of the FEM simulations and experiment measurements.

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Reduction of out-of-plane warpage in surface micromachined beams using corrugation

Cited by 14 publications

References 14 publications

A novel crenellated ionic polymer-metal composite (IPMC) actuator with enhanced electromechanical performances

A novel crenellated ionic polymer-metal composite (IPMC) actuator with enhanced electromechanical performances

An Optimisation Method of Construction for Warping Copper Plates and Engines Using Complete Block Designs with Some Special Types of Graphs

Warpage Analysis of Electroplated Cu Films on Fiber-Reinforced Polymer Packaging Substrates

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