Reduction of stresses in thin films by high energy ion beams

Jain, Amitabh; Loganathan, S.; Jain, Uma

doi:10.1016/s0168-583x(96)00850-6

Cited by 7 publications

(2 citation statements)

References 8 publications

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“…We propose that these loops are not present in the SA films, whose lattice constants are much closer to that of the molybdenum standard. Notably, the role of interstitial loops in producing compressive stresses in as-grown and post-deposition irradiation films has recently become a subject of interest to the community [51,52].…”

Section: Microstructurementioning

confidence: 99%

Activation analysis of deformation in evaporated molybdenum thin films

Yoder¹,

Elmustafa²,

Lin³

et al. 2003

J. Phys. D: Appl. Phys.

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Using nanoindentation, we investigate hardening mechanisms in steered arc (SA) evaporated and electron-beam (EB) evaporated molybdenum thin films. Both films have columnar grains, with the column diameters ranging between 22 and 170 nm in the SA films and 30 and 40 nm in the EB films. The Hall-Petch relation is extended out to hardness values between 6 and 12 GPa. Analysis of nanoindentation creep data (creep, load relaxation, and rate change) reveals that, in the SA films, thermally activated glide is rate controlling, and that grain size has little effect on the underlying rate processes even down to 22 nm. There is evidence based on x-ray diffraction (and supported by the literature) that the EB films contain high densities of interstitial loops resulting from argon ion bombardment during deposition. The analysed creep data indicate that these loops affect the thermal activation of dislocations.

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Section: Microstructurementioning

confidence: 99%

Activation analysis of deformation in evaporated molybdenum thin films

Yoder¹,

Elmustafa²,

Lin³

et al. 2003

J. Phys. D: Appl. Phys.

View full text Add to dashboard Cite

show abstract

“…The films prepared by physical and chemical vapor deposition techniques (PVD, CVD) usually exhibit tensile or compressive residual stresses, which may enhance the functional properties of the components or result in degradation phenomena like cracking and loss of adhesion. In order to perform post-deposition stress engineering in tungsten and also other types of thin films, ion irradiation has been used to modify (mainly tensile) stresses [4][9] [10].…”

Section: Introductionmentioning

confidence: 99%