2002
DOI: 10.1016/s0022-0248(01)02128-5
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Reduction of threading dislocation density in AlXGa1−XN grown on periodically grooved substrates

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Cited by 11 publications
(11 citation statements)
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“…However, these methods are not appropriate for AlGaN because the Al-alloys also nucleate on the mask materials [1,63]. Recently, growth on substrates periodically patterned into terraces and trenches has been proven successful to achieve thick, crack-free AlGaN layers [34,64,65], [66]. However this method is liable to the formation of specific micro-domains in the thick AlGaN layers, exhibiting different Al-concentrations [10,11], as will be directly visualized by cross-sectional scanning CL microscopy in the following (Fig.…”
Section: Lateral Seeding Epitaxy Of Algan On Trench Patterned Ganmentioning
confidence: 99%
“…However, these methods are not appropriate for AlGaN because the Al-alloys also nucleate on the mask materials [1,63]. Recently, growth on substrates periodically patterned into terraces and trenches has been proven successful to achieve thick, crack-free AlGaN layers [34,64,65], [66]. However this method is liable to the formation of specific micro-domains in the thick AlGaN layers, exhibiting different Al-concentrations [10,11], as will be directly visualized by cross-sectional scanning CL microscopy in the following (Fig.…”
Section: Lateral Seeding Epitaxy Of Algan On Trench Patterned Ganmentioning
confidence: 99%
“…The development of an Al x Ga 1-x N material with an appropriate composition of Al as a substrate is very important to make high-performance UV region devices because the AlGaN has direct wide bandgaps ranging from 3.4 eV to 6.2 eV [1][2][3][4]. Though there have been reports on UVdevices fabricated by using of AlGaN/GaN heterostructures grown on sapphire substrates, the device performances such as life time, light output power and wavelength are still need to be improved [5][6][7].…”
Section: Introductionmentioning
confidence: 99%
“…However these devices are composed of AlGaN-based III-V nitrides with higher Al content and the large lattice mismatch between GaN and AlGaN degrades the crystalline quality of AlGaN layers. It is difficult that the TDs in AlGaN layers are reduced by the ELO technique because of nucleation of poly-crystals on the mask surface [11][12][13][14]. Furthermore, the AlGaN layer is susceptible to fluctuations of Al content, which lead to fluctuations of the lattice constant and generate the local stress.…”
Section: Introductionmentioning
confidence: 99%
“…In order to fabricate low TD density AlGaN layer, air-bridged structure is effective in avoiding a bad influence from the poly-crystals on the mask surface. The air-bridged AlGaN layers are fabricated on patterned sapphire, patterned GaN on SiC, and patterned GaN on sapphire [12][13][14][15]. Though the fluctuations of Al content are important issues, there are few reports about ELO AlGaN layers.…”
Section: Introductionmentioning
confidence: 99%