Reliability Analysis of Lead-Free Solder Castellations

Salmela, Olli; Nieminen, Tuomo; Särkkä, Jussi; Tammenmaa, Markku

doi:10.1109/tcapt.2007.906705

Cited by 8 publications

(10 citation statements)

References 8 publications

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“…In general the failure mechanism for solder interconnections observed in this study correlated with the observations of both Salmela and Kuusiluoma: cracking of the solder material itself [13,22].…”

Section: Casesupporting

confidence: 86%

“…The failure mechanisms observed for solder interconnections differ somewhat from the customary for solder connections in traditional rigid-substrate electronics [22]. Salmela et al found that the crack angle in a solder connection is below 45°whereas in our study the crack was practically at 90°to the substrate when measured from the corner of the component.…”

Section: Casecontrasting

confidence: 51%

See 1 more Smart Citation

Reliability of ICA attachment of SMDs on inkjet-printed substrates

Niittynen

Kiilunen

Putaala

et al. 2012

Microelectronics Reliability

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Section: Casesupporting

confidence: 86%

Section: Casecontrasting

confidence: 51%

Reliability of ICA attachment of SMDs on inkjet-printed substrates

Niittynen

Kiilunen

Putaala

et al. 2012

Microelectronics Reliability

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“…Pan et al [6] first attempted to obtain an acceleration factor model using several thermal cycle profiles, in which the temperature range, maximum temperature and the cycle time or frequency were systematically varied. However, it has been shown in several studies [7,8] that this model prediction is not well correlated with experimental results. Studies by Salmela [8], and Zhang and Clech [7] evaluated several different types of AF models.…”

Section: Introductionmentioning

confidence: 86%

“…However, it has been shown in several studies [7,8] that this model prediction is not well correlated with experimental results. Studies by Salmela [8], and Zhang and Clech [7] evaluated several different types of AF models. Those AF models also include models based on the compact strain energy analysis and the finite element analysis.…”

Section: Introductionmentioning

confidence: 86%

An acceleration model for lead-free (SAC) solder joint reliability under thermal cycling

Vasudevan

Fan

2008

2008 58th Electronic Components and Technology Conference

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The electronics industry has successfully transitioned from Sn/Pb to Pb free (LF) solder for computing and consumer electronics applications. However, there is no industry-wide standardized LF solder joint reliability model (neither empirical nor FEA-based) available for solder fatigue reliability assessment. A LF solder fatigue model has been proposed in this paper based on a 3-parameter modified Coffin-Manson approach. The proposed model showed best fit to the experimental data (17 pairs of temperature cycle test data) from different sources for multiple package types and sizes including various test conditions. The model fit to the experimental data was excellent and the error was less than 6%. This analysis showed that the LF acceleration factor (AF) model is not significantly different from the Sn/Pb model and proposed model provides best fit to experimental results. IntroductionWhile the electronics industry has successfully completed the transition to Pb-free (LF) technology for computing and consumer electronics applications, there is still no standardized LF solder joint reliability model (neither empirical nor FEA-based) available for solder fatigue. Numerous studies have been published regarding the thermal cycling reliability of SnAgCu solder joints under accelerated test conditions [e.g., 1-5]. The acceleration factor (AF) models for LF are of particular interests to the electronics industry for the simple reason that the solder joint reliability in field power cycling conditions can be predicted in a simple yet accurate manner. Pan et al [6] first attempted to obtain an acceleration factor model using several thermal cycle profiles, in which the temperature range, maximum temperature and the cycle time or frequency were systematically varied. However, it has been shown in several studies [7,8] that this model prediction is not well correlated with experimental results. Studies by Salmela [8], and Zhang and Clech [7] evaluated several different types of AF models. Those AF models also include models based on the compact strain energy analysis and the finite element analysis. It showed that the FEA based models have limited success in predicting the AF factors, especially when test conditions and package types vary dramatically.In this paper, a LF acceleration factor model is proposed based on the Norris-Landzberg equation. A total of 17 pairs of experimental data suitable for acceleration factor computations, taken from Intel and industry published test data, were used to calibrate and support the model. These data

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“…It is assumed that this value will have alternative values if the material is different [1]. Previously [2,3], we showed that the ' 2 f ε factor obtains an average value of 0.558 for a leadfree solder. We came to this conclusion by re-calibrating Engelmaier's model with a considerable amount of test data.…”

Section: Introductionmentioning

confidence: 99%

Multipurpose lead-free reliability prediction model

Salmela

Putaala

Nousiainen

et al. 2016

2016 Pan Pacific Microelectronics Symposium (Pan Pacific)

Self Cite

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In this paper, an interconnection reliability prediction model capable of providing lifetime estimates for various material and structural combinations is presented. This model was first introduced in Pan Pacific conference in 2005. There, Engelmaier's model was re-calibrated for ceramic components assembled using lead-free solder on organic printed wiring boards, and the fatigue ductility coefficient was suggested to be replaced by a stress-dependent correction term.Since those days, the model has gained quite some popularity and both its validity and accuracy have been proven. Moreover, materials and interconnection types that the model is valid for have significantly been extended. Now, for example lead-free solder castellations, collapsible and non-collapsible lead-free BGA solder joints can be accounted for in the model. In this paper, a new use case to the list is introduced: attaching power devices to their heat sink. A new interpretation of distance to neutral point in case of one single solder joint is needed for that.The correction term has also developed since Engelmaier's days from constant value through logarithmic model to second-order polynomial shape. This paper summarizes this development in a user-friendly way that makes it easy for the practitioner to choose the right one for his specific purpose. Also, the expected accuracy of each approach is estimated. In addition to Engelmaier's model, where absolute lifetime predictions are looked for, a parallel relative, acceleration-factor-based reliability prediction model using Norris-Landzberg model is provided.

show abstract

Reliability Analysis of Lead-Free Solder Castellations

Cited by 8 publications

References 8 publications

Reliability of ICA attachment of SMDs on inkjet-printed substrates

Reliability of ICA attachment of SMDs on inkjet-printed substrates

An acceleration model for lead-free (SAC) solder joint reliability under thermal cycling

Multipurpose lead-free reliability prediction model

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