Reliability and failure analysis of SAC 105 and SAC 1205N lead-free solder alloys during drop test events

Wu, Mei-Ling; Lan, Jia-Shen

doi:10.1016/j.microrel.2017.12.013

Cited by 28 publications

(11 citation statements)

References 17 publications

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“…Accordingly, a process with the following conditions A solder joints loop was implemented using a daisy-chain design. To determine the failure and monitor the damage level, the resistance of the solder joint loop was considered as the failure criteria [33], [34]. A 10% increase of the electrical resistance was considered as the failure criteria provided that five consecutive tests confirm the results [35].…”

Section: B Experimental Drop Test Proceduresmentioning

confidence: 99%

“…Since the mechanical properties such as bending stiffness of the PCB, solder interconnections and BGA chip is different from each other, peel/push and shear stresses at the interconnection interface is induced [33]. However, the amount of created shear stress is lower than the peeling stress.…”

Section: Fatigue Lifetime Modelmentioning

confidence: 99%

“…An exponential fatigue lifetime equation is able to characterize the behavior of the solder joints under drop impacts provided that the curve-fitting coefficients are well estimated. In this regard, it was widely reported that the peeling stress can be considered as an index in evaluating the lifetime of the solder joints in the electronic devices [21], [33], [37]. Accordingly [33],…”

Section: Fatigue Lifetime Modelmentioning

confidence: 99%

“…In addition, several studies have been undertaken to investigate the drop impacts on the electronic devices considering diverse conditions including PCB materials, solder alloys, PCB arrangement, solder joint geometry, and type [15]- [18]. Wu and Lan [19] investigated the behavior of two different lead-free solder alloys including Sn-1.0Ag-0.5Cu and Sn-1.2Ag-0.5Cu with nickel in the electronic devices under drop impacts and established a simulation-based low-cycle fatigue predictive model for them using the JEDEC Condition B drop test. The stress-induced in the solder joint was used in the proposed predictive model.…”

Section: Introductionmentioning

confidence: 99%

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Reliability Characterization of Solder Joints in Electronic Systems Through a Neural Network Aided Approach

et al. 2022

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Rapid and precise reliability evaluation of electronic circuits plays a key role in the design stage of the electronic systems. The task becomes even more difficult when several major parameters contribute into the reliability evaluation. This paper proposes a neural network aided approach as a prediction tool for estimating the useful lifetime of the ball shaped solder joint as the most resistless part under accidental drops in the electronic devices. Several contributory factors including ball grid array (BGA) chip location, printed circuit board (PCB) thickness, solder alloy composition and solder ball volume are considered in our proposed rapid prediction model and their effects are investigated. 480 finite element simulations as well as 20 experimental tests are performed to obtain an enriched database for our neural network based prediction model. The accuracy of the proposed model is calculated as 97.55% in comparison with the finite element and the experimental results. Ability of considering multi contributory factors in the reliability evaluation of the BGA chip makes our proposed approach be a suitable candidate in design for reliability of the electronic systems.INDEX TERMS Solder joint, drop test, lifetime estimation, machine learning.

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Section: B Experimental Drop Test Proceduresmentioning

confidence: 99%

Section: Fatigue Lifetime Modelmentioning

confidence: 99%

Section: Fatigue Lifetime Modelmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Reliability Characterization of Solder Joints in Electronic Systems Through a Neural Network Aided Approach

et al. 2022

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“…According to the design, smartphones mainly consist of printed circuit board assembly (PCBA), display, battery and camera, among which PCBA is the core component and is embedded with the largest quantity of elements (Ji and Yang, 2008). In general, the failure causes of PCBA include drilling, plated through hole (PTH) (Li et al , 2017; Yao et al , 2014; Willis, 2008), etching, electroless nickel/immersion gold (ENIG) (Chen et al , 2014; Yan et al , 2013), soldering mask (Sperança et al , 2018) and reflow soldering (Wu and Lan, 2018; Wu et al , 2018; Li and Sun, 2017). For PTH, Li proposed a life prediction model of multilayered PTH based on fatigue mechanism (Li et al , 2017); for ENIG, Yan studied the failure case of un-wetting surface of the ENIG (Yan et al , 2013).…”

Section: Introductionmentioning

confidence: 99%

Failure analysis on cracking of blind and buried vias of printed circuit board for high-end mobile phones

Tang

Gong

Yang

2019

SSMT

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Purpose The submitted paper is mainly concerned with the cracking of blind and buried vias of printed circuit board (PCB) for smartphones which were encountered with abnormal display problems like scramble display or no display during service and had to be recalled. Design/methodology/approach To found out the root causes of this failure and dissolve this commercial dispute, comprehensive failure analysis was performed on the printed circuit board assemblies (PCBAs) and PCBs of the failed smartphone, such as macrograph and micrograph observation, chemical compositions analysis, thermal performance testing and blind via pull-off experiment, which finally helped to determine the causes. Besides that, the failure mechanisms were discussed in detail, and pertinent countermeasures were proposed point by point. Findings It was found that the PCB blind vias cracking was the main reason for the scramble display or no display of the smartphone, and the incomplete cleaning process before copper plating was the root cause of the blind vias cracking. Practical implications Achievement of this paper would not only help to provide the solid evidence for determining the responsibility of this commercial dispute but also lead to a better understanding of the failure mechanisms and prevention methods for similar failure cases of other advanced mobile phones. Originality/value Most failure analysis researches of PCBAs only focused on the unqualified products from manufacturing, while this paper addressed a failure analysis case of PCBAs products for smartphones from actual services, which was relatively rarely reported in the past.

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RETRACTED ARTICLE: High-G drop effect on the creep-fatigue failure of SAC solder joints in BGA packages

et al. 2019

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Reliability and failure analysis of SAC 105 and SAC 1205N lead-free solder alloys during drop test events

Cited by 28 publications

References 17 publications

Reliability Characterization of Solder Joints in Electronic Systems Through a Neural Network Aided Approach

Reliability Characterization of Solder Joints in Electronic Systems Through a Neural Network Aided Approach

Failure analysis on cracking of blind and buried vias of printed circuit board for high-end mobile phones

RETRACTED ARTICLE: High-G drop effect on the creep-fatigue failure of SAC solder joints in BGA packages

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