Reliability assessment and hygroswelling modeling of FCBGA with no-flow underfill

Tee, Tong Yan; Kho, Chek Lim; Yap, D.; Toh, C.L.; Baraton, Xavier; Zhong, Zhang

doi:10.1016/s0026-2714(03)00035-0

Cited by 50 publications

(40 citation statements)

References 5 publications

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“…Tee and Ng proposed an integrated stress model during reflow [14], and the current paper is an extension of this model with interfacial fracture mechanics for delamination analysis. Combined thermo-mechanical and hygro-mechanical stress modeling was previously studied for FCBGA with no-flow underfill [15].…”

Section: Introductionmentioning

confidence: 99%

Integrated vapor pressure, hygroswelling, and thermo-mechanical stress modeling of QFN package during reflow with interfacial fracture mechanics analysis

Tee

Zhong

2004

Microelectronics Reliability

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105

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Section: Introductionmentioning

confidence: 99%

Integrated vapor pressure, hygroswelling, and thermo-mechanical stress modeling of QFN package during reflow with interfacial fracture mechanics analysis

Tee

Zhong

2004

Microelectronics Reliability

Self Cite

105

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“…Like all the plastic packages, PoP is affected by the absorption of atmospheric moisture. There are three kinds of failure mechanisms: pop-corn phenomena during the reflow process, hygroscopic swelling during its usual life and electrochemical migration [4].…”

Section: Contextmentioning

confidence: 99%

A methodological approach for predictive reliability: Practical case studies

Frémont

Duchamp

Gracia

et al. 2012

Microelectronics Reliability

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“…Moisture ingress into the package increased with increasing TH test holding time, so that the adhesive strength deteriorated after being subjected to a condensing, highly humid atmosphere. 23,24 Therefore, the drop reliability of the board-level package with underfill was limited by the underfill's sensitivity to moisture penetration. In addition, the applied drop shock stress of the board-level package was larger in the center region than in the outer region.…”

Section: Adhesive Strength Of Underfillsmentioning

confidence: 99%

Effects of Different Kinds of Underfills and Temperature–Humidity Treatments on Drop Reliability of Board-Level Packages

Noh

Yoon

et al. 2010

Journal of Elec Materi

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The hygrothermal and mechanical reliability of board-level packages with various underfills under sequential temperature and humidity (TH) testing and drop testing were investigated. Board-level packages with underfill had greater resistance to drop shock than that without underfill, indicating that underfill protects the package from failure by absorption of the applied drop shock. The underfill, which was composed of polypropylene glycol epoxy resin and silane, exhibited good reliability for drop shock because of the improved adhesion of the underfill compared with that without the polypropylene glycol epoxy resin and silane. In addition, the drop reliability of board-level packages with underfill decreased with increasing TH test duration. Adhesion between the substrate and underfill or between the solder and underfill was decreased by moisture absorption. Components positioned at the board center were more susceptible to failure by drop shock than were corner components.

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Reliability assessment and hygroswelling modeling of FCBGA with no-flow underfill

Cited by 50 publications

References 5 publications

Integrated vapor pressure, hygroswelling, and thermo-mechanical stress modeling of QFN package during reflow with interfacial fracture mechanics analysis

Integrated vapor pressure, hygroswelling, and thermo-mechanical stress modeling of QFN package during reflow with interfacial fracture mechanics analysis

A methodological approach for predictive reliability: Practical case studies

Effects of Different Kinds of Underfills and Temperature–Humidity Treatments on Drop Reliability of Board-Level Packages

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