Reliability enhancement of embedded capacitors in printed circuit boards using B-stage epoxy/BaTiO&lt;inf&gt;3&lt;/inf&gt; composite embedded capacitor films (ECFs)

Lee, Sangyong; Jang, Jong Min; Lee, Woong Sun; Paik, Kyung‐Wook

doi:10.1109/ectc.2009.5074099

Cited by 2 publications

(3 citation statements)

References 6 publications

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“…In another work, embedded capacitors were aged at 85 • C and 85% RH for 24 h and reflowed three times at 260 • C for 60 s. The capacitance was observed to decrease by 30% [27] due to delamination. The effects of material formulations, such as filler loading, dispersant, and curing agent, were investigated for delamination [27]. Scanning acoustic microscopy confirmed that delaminations can be reduced but not eliminated by decreasing the ceramic loading (which reduces the adhesion between the dielectric and the Cu plates).…”

Section: Reliability Of Embedded Capacitors Under Temperature Humentioning

confidence: 94%

“…This delamination was explained by the rapid evaporation of the absorbed moisture, and it is well known that the adhesion between polymers and other substrates is weakened when aged in humid conditions [26]. In another work, embedded capacitors were aged at 85 • C and 85% RH for 24 h and reflowed three times at 260 • C for 60 s. The capacitance was observed to decrease by 30% [27] due to delamination. The effects of material formulations, such as filler loading, dispersant, and curing agent, were investigated for delamination [27].…”

Section: Reliability Of Embedded Capacitors Under Temperature Humentioning

confidence: 95%

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Reliability of Embedded Planar Capacitors With Epoxy–$\hbox{BaTiO}_{3}$ Composite Dielectric During Temperature–Humidity–Bias Tests

Alam

Azarian

Pecht

2012

IEEE Trans. Device Mater. Relib.

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In this work, the reliability of an embedded planar capacitor with epoxy-BaTiO 3 composite dielectric was investigated under temperature-humidity-bias (THB) conditions. The temperature and humidity conditions were selected as 85 • C and 85% RH, respectively. In order to investigate the effect of an applied bias, one set of capacitors was kept unbiased, and the other set of capacitors was biased at 5 V. Capacitors of two different sizes were used to investigate the effect of area on reliability under these conditions. Three parameters-capacitance, dissipation factor, and insulation resistance-were monitored in situ every hour during the THB test, which lasted for 2000 h. Data analysis and the physical explanation of change in the electrical parameters under THB conditions are presented in this paper.

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Section: Reliability Of Embedded Capacitors Under Temperature Humentioning

confidence: 94%

Section: Reliability Of Embedded Capacitors Under Temperature Humentioning

confidence: 95%

Reliability of Embedded Planar Capacitors With Epoxy–$\hbox{BaTiO}_{3}$ Composite Dielectric During Temperature–Humidity–Bias Tests

Alam

Azarian

Pecht

2012

IEEE Trans. Device Mater. Relib.

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“…An EAC being a rectangular capacitor tile (see Fig. 3) similar to MLCCs, is constructed from high-k dielectric ceramic layers that are printed with patterned metal layer on each dielectric surface [2], [3]. These layers are processed together to form a rectangular tile, with top and bottom surfaces covered with copper that are patterned into planes and pads [9].…”

Section: Eac Considerationsmentioning

confidence: 99%

Mechanical Reliability of Embedded Array Capacitors in Ultrahigh-Performance Microprocessors

Panat

Dattaguru

Balkan

et al. 2014

IEEE Trans. Device Mater. Relib.

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Increasing power delivery and performance requirements for next-generation Intel microprocessors has led to the need for a high-capacitance low-inductance decoupling option very close to the die. An embedded array capacitor (EAC) is a large array capacitor embedded in the high-density interconnect (HDI) substrate core and provides a low-inductance path to the die. This paper describes technology development challenges encountered while enabling EACs on Intel's advanced microprocessors. Various package interfaces resulting from the EAC embedding showed very high stress and propensity to delaminate. These defects were addressed by tailoring suitable materials and process modifications during the manufacturing process. Expansion of the embedding material in the HDI substrate resulted in high C4 area warpage. This led to issues such as solder bump bridging, underfill voids, and reliability fails. The technology development challenges and the solution paths described in this paper are very useful to industry in understanding the integration of advanced decoupling options in ultrahigh-performance microprocessor packages.

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Reliability enhancement of embedded capacitors in printed circuit boards using B-stage epoxy/BaTiO<inf>3</inf> composite embedded capacitor films (ECFs)

Cited by 2 publications

References 6 publications

Reliability of Embedded Planar Capacitors With Epoxy–$\hbox{BaTiO}_{3}$ Composite Dielectric During Temperature–Humidity–Bias Tests

Reliability of Embedded Planar Capacitors With Epoxy–$\hbox{BaTiO}_{3}$ Composite Dielectric During Temperature–Humidity–Bias Tests

Mechanical Reliability of Embedded Array Capacitors in Ultrahigh-Performance Microprocessors

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