Reliability evaluation of high pin count hermetic ceramic IC packages for space applications

A low-temperature solid-state bonding method based on copper bump coated with nickel microcones and silver buffer

“…Among these different bonding technologies, metal-to-metal bonding is preferred as it allows simultaneous formation of electrical, mechanical, and hermetic bonds [6]. Although solder-based materials are widely used in the industry for the electrical connections, it suffers from poor physical properties, scalability, and reliability, which are closely related to formation of IMC in eutectic bonding [7,8]. Furthermore, the IMC does not deform as the soft solder does to accommodate the coefficient of thermal expansion (CTE) mismatch between semiconductor chips and Cu substrates.…”

Fluxless Hermetic Lid Sealing Using Electroplated Sn-Rich Solder

“…An alternative choice is Kovar package. Ceramic packages have been used to house various devices with high hermetic quality, such as MEMS, sensors, microwave devices, and imaging devices [5]- [7]. Common ceramic package materials are composed of more than 90% alumina and have nominal coefficient of thermal expansion (CTE) of 7 ppm/ C. Kovar, with CTE of 5 ppm/ C, is the most commonly used lid material for ceramic packages.…”

Customized glass sealant for ceramic substrates for high temperature electronic application

“…For highly reliable packages in which excellent thermal stability and impermeability are essential, ceramic-based packages are preferred over plastics [6][7][8]. The demand for ceramic packages has increased a lot recently for the high performance hermetically sealed devices such as MEMS, sensors, microwave devices, and imaging devices [9,10]. Alumina (Al 2 O 3 ) and aluminum nitride (AlN)-based ceramics are used in many special applications where density, high hardness, chemical inertness, low thermal conductivity and good high temperature properties are required [11][12][13].…”