Reliability experiments of sintered silver based interconnections by accelerated isothermal bending tests

Heilmann, Jens; Nikitin, Ivan; Zschenderlein, Uwe; May, Daniel; Pressel, K.; Wunderle, Bernhard

doi:10.1016/j.microrel.2017.04.016

Cited by 32 publications

(3 citation statements)

References 16 publications

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“…Generally, the AgSn-TLP joints offer high-temperature stability and improved shear strengths that is up to 50–60 MPa (Shao et al , 2017), which are substantially higher than the values of Sn-based solders (Siewert et al , 2002; Kang et al , 2020) and comparable to sintered silver die bonds (Esa et al , 2021; Heilmann et al , 2023; Strahringer and Wilde, 2023).…”

Section: Introductionmentioning

confidence: 99%

Anand constitutive modeling of multilayer Silver-Tin transient liquid phase foils using tensile and creep testing

Gharaibeh,

Feisst,

Wilde

2024

SSMT

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Purpose This paper aims to present two Anand’s model parameter sets for the multilayer silver–tin (AgSn) transient liquid phase (TLP) foils. Design/methodology/approach The AgSn TLP test samples are manufactured using pre-defined optimized TLP bonding process parameters. Consequently, tensile and creep tests are conducted at various loading temperatures to generate stress–strain and creep data to accurately determine the elastic properties and two sets of Anand model creep coefficients. The resultant tensile- and creep-based constitutive models are subsequently used in extensive finite element simulations to precisely survey the mechanical response of the AgSn TLP bonds in power electronics due to different thermal loads. Findings The response of both models is thoroughly addressed in terms of stress–strain relationships, inelastic strain energy densities and equivalent plastic strains. The simulation results revealed that the testing conditions and parameters can significantly influence the values of the fitted Anand coefficients and consequently affect the resultant FEA-computed mechanical response of the TLP bonds. Therefore, this paper suggests that extreme care has to be taken when planning experiments for the estimation of creep parameters of the AgSn TLP joints. Originality/value In literature, there is no constitutive modeling data on the AgSn TLP bonds.

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Section: Introductionmentioning

confidence: 99%

Anand constitutive modeling of multilayer Silver-Tin transient liquid phase foils using tensile and creep testing

Gharaibeh,

Feisst,

Wilde

2024

SSMT

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“…In addition to these experimental pursuits, substantial efforts have been directed toward establishing the constitutive relationship of nano-silver paste. The Anand constitutive model is widely acknowledged as a potent tool for predicting the stress–strain relationship of soldered materials at diverse temperature settings in microelectronics [ 15 , 17 , 18 , 19 ]. However, the Anand model, being a phenomenological model, primarily focuses on the macroscopic material properties of silver paste.…”

Section: Introductionmentioning

confidence: 99%

A Micromechanical Analysis to the Viscoplastic Behavior of Sintered Silver Joints under Shear Loading

Liu

Sun

et al. 2023

Materials

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Ag paste has been recognized as a promising substitute for Sn/Pb solder in SiC or GaN power electronic devices, owing to its ability to withstand high temperatures and facilitate low-temperature packing. The reliability of these high-power circuits is greatly influenced by the mechanical properties of sintered Ag paste. However, there exist substantial voids inside the sintered silver layer after sintering, and the conventional macroscopic constitutive models have certain limitation to describe the shear stress–strain relationship of sintered silver materials. To analyze the void evolution and microstructure of sintered silver, Ag composite pastes composed of micron flake silver and nano-silver particles were prepared. The mechanical behaviors were studied at different temperatures (0–125 °C) and strain rates (1 × 10−4–1 × 10−2) for Ag composite pastes. The crystal plastic finite element method (CPFEM) was developed to describe the microstructure evolution and shear behaviors of sintered silver at varied strain rates and ambient temperatures. The model parameters were obtained by fitting experimental shear test data to a representative volume element (RVE) model built on representative volume elements, also known as Voronoi tessellations. The numerical predictions were compared with the experimental data, which showed that the introduced crystal plasticity constitutive model can describe the shear constitutive behavior of a sintered silver specimen with reasonable accuracy.

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“…Due to their mechanical deformability, such devices have been gaining importance in various applications such as flexible displays and wearables [1]. For fabricating a flexible electronic device, various methods have been used including screen printing, gravure printing [2,3], offset printing [4], and airbrushing [5]. With the development of better screens and automated screen printers, screen printing has evolved to be one of the most reproducible high volume fabrication methods [6].…”

Section: Introductionmentioning

confidence: 99%

Flexible screen-printed coils for wireless power transfer using low-frequency magnetic fields

Sondhi

Garraud

Alabi

et al. 2019

J. Micromech. Microeng.

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We report the fabrication and testing of a multilayer flexible screen-printed coil that can be used to generate low-frequency (<1 kHz) magnetic fields for applications such as electrodynamic wireless power transmission (EWPT). Compared to traditional coil-forming methods, screen printing enables rapid fabrication of thin, light weight, conformable, and flexible structures. The flexibility is demonstrated by repeated bending of a stack of up to three layers for a curvature (inverse bending radius) of 53.2 mm −1 . We also demonstrate wireless power transmission of 1 mW of power at a distance of 4 cm between the flexible receiver and transmitter. The effect of the flexibility is observed through a 32% power increase when the receiver is bent concavely and a 20% output power decrease when the stack is bent convexly. It is also seen that the insertion of a 0.2 mm-thick soft-magnetic material sheet increased the magnetic field by 41% from its original value. Mechanical cycling was also performed for the stack. After 10 000 bending cycles, a 16.4% increase in the coil resistance was measured for a 0.33 Hz frequency and 78% increase for a 1 Hz cycling frequency, respectively. Screen printed 3D flexible transmitter coils can enable the incorporation of EWPT for wireless charging in applications such as healthcare and consumer-based electronics.

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Reliability experiments of sintered silver based interconnections by accelerated isothermal bending tests

Cited by 32 publications

References 16 publications

Anand constitutive modeling of multilayer Silver-Tin transient liquid phase foils using tensile and creep testing

Anand constitutive modeling of multilayer Silver-Tin transient liquid phase foils using tensile and creep testing

A Micromechanical Analysis to the Viscoplastic Behavior of Sintered Silver Joints under Shear Loading

Flexible screen-printed coils for wireless power transfer using low-frequency magnetic fields

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