Reliability of Fan-Out Wafer-Level Packaging with Large Chips and Multiple Re-Distributed Layers

Recent Advances and Trends in Fan-Out Wafer/Panel-Level Packaging

“…The sample size is also 60. The thermal cycling test stops at 1100 cycles and there are 14 failures (including one early failed at 58 cycles) It can be seen that the characteristic life (63.2% failed) of the Weibull plot is 2382 cycles, which is more than adequate for the expecting life (usually is less than 3 yr) of mobile product such as the smartphones and tablets [87]. The failure mode is shown in the right-hand side of Fig.…”

State of the Art of Lead-Free Solder Joint Reliability

“…For mobile products, completing a drop test is a very important task. The package and the PCB are the same as those [18][19][20][21][22] for the thermal cycling test. The drop test setup is according to JEDEC Standard JESD22-B111 as shown in Fig.…”

“…Figure 37 shows a fan-out wafer-level package (13.42 mm  13.42 mm) with a very large silicon chip (10 mm  10 mm), which is lead-free (Sn3Ag0.5Cu) solder balled on a PCB as shown in Fig. 2 [18][19][20][21][22]. The finite element model is shown in Fig.…”

“…Thermal cycling is the most common test in solder joint reliability. For example, the solder joint reliability of a fan-out wafer-level package of a 10 mm  10 mm chip on a PCB [18][19][20][21][22], as shown in Fig. 2, subjected to thermal cycling has been reported.…”