2018
DOI: 10.1016/j.fusengdes.2018.02.082
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Removing W-contaminants in helium and neon RF plasma to maintain the optical performance of the ITER UWAVS first mirror

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Cited by 14 publications
(8 citation statements)
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“…The new RF-based cleaning system developed for the US-lead Upper Port Wide Angle Viewing System was capable for removing 10-20 nm of tungsten from the SC Mo mirror. No mirror damage has occurred after cleaning and the surface roughness of the mirror did not increase [38].…”
Section: Mirror Surface Recovery (Msr) 231 Finding An Optimum Sc Orie...mentioning
confidence: 93%
“…The new RF-based cleaning system developed for the US-lead Upper Port Wide Angle Viewing System was capable for removing 10-20 nm of tungsten from the SC Mo mirror. No mirror damage has occurred after cleaning and the surface roughness of the mirror did not increase [38].…”
Section: Mirror Surface Recovery (Msr) 231 Finding An Optimum Sc Orie...mentioning
confidence: 93%
“…For the ETS mirrors with the area of approximately 600 cm 2 , that would lead to high powers. From other experiments [2,17,18] the surface power density could be estimated as 0.5-1 W cm −2 , that was sufficient to generate ion fluxes of 5•10 18 ions•m 2 s −1 with energies 50-150 eV to remove Al/Al 2 O 3 films (considered as Besubstitutes for experiments where beryllium could not be used) with a rate of 1-2 nm h −1 .…”
Section: Configuration With Notch Filtermentioning
confidence: 99%
“…In laboratory setups, the efficiency of plasma cleaning was demonstrated and analyzed in relation to various configurations of first diagnostic mirrors and for assorted deposits to be cleaned [3,[14][15][16]. In earlier experiments, feasibility of plasma cleaning was discussed for the Ultra-Wide Angle Visible Spectroscopy diagnostic system [2,17,18]. The electrical circuit of the plasma cleaning system was modeleld for the Visible Spectroscopy Reference System [5,19].…”
Section: Cleaning Discharge Requirementsmentioning
confidence: 99%
“…This results in ion acceleration towards the FM with an energy of e(V p − V DC ), where V p is the plasma potential, and leads to sputtering of surface deposits given the ion energy is greater than the sputtering energy threshold of the deposits. Plasma cleaning of FM deposits via CCRF discharges has been a subject of intense investigation in recent years [7][8][9][10].…”
Section: Introductionmentioning
confidence: 99%