2002
DOI: 10.1145/774572.774614
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Repeater insertion and wire sizing optimization for throughput-centric VLSI global interconnects

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Cited by 20 publications
(2 citation statements)
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“…The international technology roadmap for semiconductor report on interconnect indicated that crosstalk noise will become the dominant problem affecting propagation delays, hence degrading overall system performance [1]. Techniques to avoid the crosstalk delay have been proposed by many researchers [2–9]. These methods are applied on different levels of the design; physical level solutions include wire sizing optimisation, shield insertion and repeater insertion [6, 10].…”
Section: Introductionmentioning
confidence: 99%
See 1 more Smart Citation
“…The international technology roadmap for semiconductor report on interconnect indicated that crosstalk noise will become the dominant problem affecting propagation delays, hence degrading overall system performance [1]. Techniques to avoid the crosstalk delay have been proposed by many researchers [2–9]. These methods are applied on different levels of the design; physical level solutions include wire sizing optimisation, shield insertion and repeater insertion [6, 10].…”
Section: Introductionmentioning
confidence: 99%
“…Techniques to avoid the crosstalk delay have been proposed by many researchers [2–9]. These methods are applied on different levels of the design; physical level solutions include wire sizing optimisation, shield insertion and repeater insertion [6, 10]. Other techniques are implemented on the data link layer; this consists of data encoding to avoid crosstalk [7].…”
Section: Introductionmentioning
confidence: 99%