2006
DOI: 10.1016/j.scriptamat.2006.08.047
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Residual stress relaxation of deep-rolled Al–Mg–Si–Cu alloy during cyclic loading at elevated temperatures

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Cited by 71 publications
(32 citation statements)
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“…With regard to this work, it can be clearly seen that for the foams heated at 150 • C, the internal stress should be eliminated at 4 h, resulting in the lowest micro-hardness and yield strength. While, for the foams that were heated at 250 • C, the micro-hardness and yield strength decreased to the lowest value at 2 h. Moreover, it was shown from Figures 6 and 8 that the foams heated at 320 • C, 400 • C, and 500 • C possess the lowest micro-hardness and yield strength when the holding time was 1 h. It was obviously indicated that the internal stress was released more efficiently at higher temperature, which was consistent with the reported literature [29][30][31]. While, it is reasonable to infer that the lowest value can be actually yielded with the holding time less than 1 h when the heating temperature is higher than 320 • C.…”
Section: Discussionsupporting
confidence: 87%
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“…With regard to this work, it can be clearly seen that for the foams heated at 150 • C, the internal stress should be eliminated at 4 h, resulting in the lowest micro-hardness and yield strength. While, for the foams that were heated at 250 • C, the micro-hardness and yield strength decreased to the lowest value at 2 h. Moreover, it was shown from Figures 6 and 8 that the foams heated at 320 • C, 400 • C, and 500 • C possess the lowest micro-hardness and yield strength when the holding time was 1 h. It was obviously indicated that the internal stress was released more efficiently at higher temperature, which was consistent with the reported literature [29][30][31]. While, it is reasonable to infer that the lowest value can be actually yielded with the holding time less than 1 h when the heating temperature is higher than 320 • C.…”
Section: Discussionsupporting
confidence: 87%
“…In addition, the different thermal conductivity and heat diffusivity between CMs and the matrix will also cause internal stress. Internal stress relaxation is governed by a thermal activated mechanism, which can be described by the Zener-Wert-Avrami relationship as the following equation shows [29][30][31]:…”
Section: Discussionmentioning
confidence: 99%
“…To provide an analytical description of the thermal residual stress relaxation, we propose a stress relaxation model by employing the ZenereWerteAvrami function [11,26],…”
Section: Resultsmentioning
confidence: 99%
“…Techniques include X-ray diffraction (XRD), HEXRD and ND. Residual stress measurements were undertaken in nanocrystalline aluminium alloy (3mm×3mm×5mm parallelepiped) [10], in nanocomposite metals (1mm 2 in cross-section and 15mm in length) [11], in metal or alloy thin films (typically 50 to 2000nm thick films deposited on substrates) [12,13], in single phase polycrystalline beryllium (5mm in diameter and 20mm in length) [14], and in laboratory sized specimens manufactured from engineering alloys or metal matrix composites [15][16][17][18][19][20][21][22].…”
Section: Introductionmentioning
confidence: 99%