Residual stresses in silicon-on-sapphire thin film systems

Pramanik, Alokesh; Zhang, Liangchi

doi:10.1016/j.ijsolstr.2011.01.010

Cited by 14 publications

(6 citation statements)

References 36 publications

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“…In addition, multipurpose X-ray thin film diffractometer (Rigaku ATX-E; D/MAX2500) was used to measure the stress value. 17,18) 3. Results and Discussion Figure 1 shows SEM images of three Ag films (30, 110 and 400 nm) with different thickness.…”

Section: Methodsmentioning

confidence: 99%

The Effects of Crystallization on Mechanical Mechanism and Residual Stress of Sputtered Ag Thin Films

Hung

Lui

et al. 2012

Mater. Trans.

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Silver film is widely used in optoelectronic and semiconductor industries, but its stress problem has not been verified. Sputtered Ag films of different thicknesses were used to investigate the effect of the crystallization on their solidification residual stress and electrical properties. From XRD data (2ª > 90°), an increase the thickness of the Ag film from 30 to 400 nm, not only raised the index of crystallization, but also obtained a lower resistivity. However, the peak (331) had a dissolution tendency due to the residual stress. The grain size of Ag films with greater thickness had grown because of the longer sputtering duration. Due to variations in the crystallized texture, the 30 and 110 nm films showed no sign of elasticity under nano-indentation testing. Under low-energy XRD (30 kV-20 µA), the 30 nm film not only had more residual stress, but also formed a new plane of diffraction at 104.2°of 2ª and the actual compressive stress value was 14.94 MPa. After an electrical current induced crystallization (EIC) test, the resistivity and residual stress of Ag film were improved.

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Section: Methodsmentioning

confidence: 99%

The Effects of Crystallization on Mechanical Mechanism and Residual Stress of Sputtered Ag Thin Films

Hung

Lui

et al. 2012

Mater. Trans.

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“…However, this technique similarly as other PVD processes usually develops high values of residual stresses . The residual stresses in a thin film system can lead to: buckling, cracking, a void formation, and a film debonding . For a room temperature deposition, stresses easily can reach an unacceptable level .…”

Section: Fe Model On Micro‐scalementioning

confidence: 99%

Development and Application of Multi‐Scale Numerical Tool to Modeling Pneumatic Ventricular Assist Devices with Increased Athrombogenicity

Kopernik

2014

Adv Eng Mater

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The multi-scale numerical model of blood chamber of ventricular assist device (VAD) with deposited a biocompatible titanium nitride (TiN) nano-coating is introduced. The model is developed to optimize shape parameters of the blood chamber and to determine fracture parameters of the nano-coating. The development of finite element (FE) macro-model is combined with a digital image correlation data to validate a computed strain state. Contrary, on a micro-scale calibration and validation of a representative volume element (RVE) model of the wall of VAD composed of the TiN coating and substrate-polymer is realized by comparison with results of an experimental in situ SEM's micro-tensile test. The multi-scale model of VAD is enriched with materials research. Thus, tensile tests of VADs' polymers are performed to obtain the properties of designed materials of the VADs. On the other hand, on a micro-scale, the properties of TiN are identified based on a nanoindentation test and an inverse analysis for its interpretation. The profilometric studies and analytical model are presented to calculate a residual stress in the TiN. The final result of the paper is the multi-scale numerical tool to modeling pneumatic VADs with increased biocompatibility produced in Poland. REVIEW Fig. 2. The general conception of the multiÀscale model of VAD's blood chamber: (a) a residual stress modeling and (b) an active load modeling. Reproduced with permission. [15] Fig. 7. The distribution of displacement in Z direction on an external surface of the blood chamber of the VAD under pressure 37.3 kPa and in temperature 37 C: (a) the DIC's result, mm, (b) the FE model's result in the VADFEM code, mm, (c) standard deviation of the DIC's ZÀdirectional displacement (in mm), and (d) standard deviation of the DIC's XÀdirectional principal strains (shown values × 10 − 3 ). Reproduced with permission. [33] 285 REVIEW Fig. 9. Local distributions of (a) an effective strain and (b) a triaxiality factor in the model 4 of prototype of the Polish VAD. Reproduced with permission. [17] The AFM's image of topography of the TiN nano-coating of thickness 50 nm on the selected line of the area 100 nm Â 100 nm; (b) the AFM's image of topography of the TiN nano-coating of thickness 100 nm on the selected line of the area 1 mm Â 1 mm.

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“…However, this technique similarly as the other physical vapour deposition (PVD) processes usually develops high values of residual stresses [12]. The residual stresses in the layer deposited by PVD methods result from the mismatch of the lattice parameters and of the thermal expansion properties between a thin film and substrate [13]. For the PLD process, kinetic energies of ions and neutral species in an ablation plume can range from a few tenths to several hundred electron volts and are sufficient to modify a stress state of superficial layers through defect formation [14].…”

Section: Introductionmentioning

confidence: 99%

“…The compressive stress state is typical for layers deposited from an unabated energetic plume. The residual stresses in a thin film system can lead to buckling, cracking, void formation, and film debonding [13]. For the room temperature deposition, the stresses easily can reach an unacceptable level [11].…”

Section: Introductionmentioning

confidence: 99%

Stress‐Strain Analysis in TiN Nanocoating Deposited on Polymer with respect to Au Nanointerlayer

Kopernik

Milenin

Kąc

et al. 2014

Journal of Nanomaterials

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The multiscale analysis in the authors’ finite element code confirmed possibility of fracture, because of not sufficiently high level of compressive residual stress in the TiN deposited by physical deposition method and varied mechanical properties of the thin film and substrate. The residual stress cannot be identified by X-ray technique for amorphous polymer and layer with domains of crystalline TiN. It is assumed that the buffer biocompatible thin film of Au in the TiN/Bionate II material system will alter the evolution of residual stress and, therefore, will allow to determine the residual stress in profilometry studies, and helps to improve toughness of the connection between TiN and Bionate II. The introduction of Au nanocoating in the material system results in bending of the sample and a compressive residual stress in the TiN coating. Results of finite element simulation show improvement of connection between the polymer and TiN, and an increase of compressive residual stress in the coating by introduction of Au nanointerlayer results in reduction of stress and strain in the substrate (close to the boundary between substrate and coating).

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Residual stresses in silicon-on-sapphire thin film systems

Cited by 14 publications

References 36 publications

The Effects of Crystallization on Mechanical Mechanism and Residual Stress of Sputtered Ag Thin Films

The Effects of Crystallization on Mechanical Mechanism and Residual Stress of Sputtered Ag Thin Films

Development and Application of Multi‐Scale Numerical Tool to Modeling Pneumatic Ventricular Assist Devices with Increased Athrombogenicity

Stress‐Strain Analysis in TiN Nanocoating Deposited on Polymer with respect to Au Nanointerlayer

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