Resist composition effects on ultimate resolution of negative-tone chemically amplified resists

Abstract

Chemical Amplification Resists (CAR) are now widely used in optical lithography since the introduction of the deep UV era. One advantage of the CARs is also their full compatibility with electron beam writing. This paper is focused on the development work of a negative tone resist. The influence of resist compounds such as polymer matrix composition and PAG size on diffusion and ultimate resolution is detailed. Finally the pattern transfer capabilities of a 30 nm isolated line into a polysilicon layer is presented.