2007
DOI: 10.2494/photopolymer.20.315
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Resist Removal by using Wet Ozone

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Cited by 29 publications
(22 citation statements)
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“…On the other hand, ozone is applied to environmentally friendly cleaning techniques for water and semiconductor manufacturing [5][6][7][8][9][10][11][12]. Ozone water degrades compounds with C=C bond or benzene ring to carboxylic acid [13,14].…”
Section: Introductionmentioning
confidence: 99%
“…On the other hand, ozone is applied to environmentally friendly cleaning techniques for water and semiconductor manufacturing [5][6][7][8][9][10][11][12]. Ozone water degrades compounds with C=C bond or benzene ring to carboxylic acid [13,14].…”
Section: Introductionmentioning
confidence: 99%
“…As a result, large amounts of chemicals, such as H 2 SO 4 , H 2 O 2 , HCl, NH 4 OH, and amine solvents, are required in wet cleaning processes [6,7]. For safety and environmental reasons, the use of ozonized water is attracting attention as a viable method for removing organic contaminants, which has been conventionally removed by a high temperature sulfuric acid -hydrogen peroxide mixture (SPM) [8,9]. In terms of applications to semiconductor manufacturing, ozonized water cleaning systems are strongly desired as they provide enhanced removal rates for organic contaminants.…”
Section: Introductionmentioning
confidence: 99%
“…On the other hand, ozone is applied to environmentally friendly cleaning techniques for water and semiconductor manufacturing [5][6][7][8][9][10][11][12][13][14]. Ozone-water degrade compounds with C=C bond or benzene ring to carboxylic acid [15,16].…”
Section: Introductionmentioning
confidence: 99%