Resistless nanofabrication by stencil lithography: A review

Vazquez-Mena, Oscar; Groß, Leo; Xie, Shiyi; Villanueva, Luis Guillermo; Brugger, Jürgen

doi:10.1016/j.mee.2014.08.003

Cited by 95 publications

(83 citation statements)

References 136 publications

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“…The fabrication steps can be translated to wafer scale production and also applicable for more complex structures. It is envisioned that Ni shadow mask can be used for etching and ion implantation as well following the works reported in [10]. …”

Section: Resultsmentioning

confidence: 99%

“…Stencil lithography [10] and imprint lithography [11] have showed their application in overcoming drawbacks of optical lithography and laser pattering. We are using shadow mask for metal deposition on the UMEA devices to address variability and operator dependency.…”

Section: Introductionmentioning

confidence: 99%

“…Micro and nanostencil lithography have been used to pattern non-conventional substrates and biomaterials, due to its advantage of: (a) no resist processing, (b) easy manipulation and implementation, (c) reusability and (d) dynamic stencil lithography [10]. Stencils have been used in micromachining from long ago.…”

Section: Introductionmentioning

confidence: 99%

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Reusable High Aspect Ratio 3-D Nickel Shadow Mask

Shandhi

Leber

Hogan

et al. 2017

J. Microelectromech. Syst.

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Shadow Mask technology has been used over the years for resistless patterning and to pattern on unconventional surfaces, fragile substrate and biomaterial. In this work, we are presenting a novel method to fabricate high aspect ratio (15:1) three-dimensional (3D) Nickel (Ni) shadow mask with vertical pattern length and width of 1.2 mm and 40 μm respectively. The Ni shadow mask is 1.5 mm tall and 100 μm wide at the base. The aspect ratio of the shadow mask is 15. Ni shadow mask is mechanically robust and hence easy to handle. It is also reusable and used to pattern the sidewalls of unconventional and complex 3D geometries such as microneedles or neural electrodes (such as the Utah array). The standard Utah array has 100 active sites at the tip of the shaft. Using the proposed high aspect ratio Ni shadow mask, the Utah array can accommodate 300 active sites, 200 of which will be along and around the shaft. The robust Ni shadow mask is fabricated using laser patterning and electroplating techniques. The use of Ni 3D shadow mask will lower the fabrication cost, complexity and time for patterning out-of-plane structures.

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Section: Resultsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Reusable High Aspect Ratio 3-D Nickel Shadow Mask

Shandhi

Leber

Hogan

et al. 2017

J. Microelectromech. Syst.

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“…Nanopatterning using stencil-mask lithography has been applied to several materials and has a number of advantages over other structuring techniques [13,14]. In combination with the afore-mentioned specific properties of HTSCs, shadowed ion irradiation can be employed to locally modify the superconducting properties.…”

Section: Introductionmentioning

confidence: 99%

Nano-patterning of cuprate superconductors by masked He+ ion irradiation: 3-dimensional profiles of the local critical temperature

Mletschnig

Lang

2019

Microelectronic Engineering

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Irradiation of cuprate high-T c superconductors with light ions of moderate energy creates point defects that lead to a reduction or full suppression of the critical temperature. By shaping the ion flux with a stencil mask, nanostructures for emerging superconducting electronics can be fabricated. The 3-dimensional shape of such defect landscapes is examined, based on calculations of full collision cascades and atom displacements. A relation between the calculated defect density and experimental values of the critical temperature T c in thin YBa 2 Cu 3 O 7−δ films is etablished that allows to determine the distribution of local T c 's and its 3-dimensional visualization. The results confirm that, using 75 keV He + ion irradiation and a stencil mask, well-defined patterns of non-superconducting material in the superconducting matrix can be produced with low blurring.

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“…Stencil-assisted patterned deposition (often referred to as nanostencil lithography, NSL [6]) is in contrast an additive patterning technique constituting a very promising alternative: only material passing through an opening of a shadow stencil mask close to the substrate reaches the substrate, thus avoiding subtractive patterning steps. The obtained structures share a similar shape to the apertures of the stencil.…”

Section: Introductionmentioning

confidence: 99%