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AbstractPurpose -The purpose of this paper is to share valuable information about metallization in microelectronic industries by implementing tungsten silicide (WSi) thin film materials. Design/methodology/approach -Direct current plasma magnetron sputtering technique was employed for the WSi film growth. Different sputtering parameters were investigated, and the WSi films were characterized using four-point probe electrical measurement method. Findings -The experimental results reveal that the sputtering parameters such as deposition pressure and substrate temperature exert significant influence on the electrical properties of the WSi films.Research limitations/implications -By tuning the sputtering parameters, the electrical properties of the WSi films can be optimized and the film resistivity can be reduced significantly. Practical implications -The investigation results presented in this paper are useful information for microelectronic industries in the area of microelectronic devices metallization. Originality/value -The fabrication method described in this paper allows fabricating low-resistivity WSi films by employing a lower deposition pressure and a lower substrate temperature.