RF MEMS adjustable impedance matching network and adjustable power divider

Ünlü, M. Selim; Topallı, Kağan; Sagkol, H.; Demır, Şımşek; Çivi, Özlem Aydın; Koc, Sencer; Akın, Tayfun

doi:10.1109/aps.2002.1016020

Cited by 5 publications

(3 citation statements)

References 3 publications

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“…Considering all uncertainties, the measured temperature is within 2% of the experimental error measured in Celsius degree. The temperature sensitivity of 30 mV/K with a dc current input of 0.01 A can be estimated from (15) This sensitivity corresponds to temperature resolution of 0.3 K, which is high among the temperature measurement techniques listed in Table I.…”

Section: Temperature and Rf Power Extractionmentioning

confidence: 99%

“…Commonly used configurations of suspended MEMS transmission-line structures: (a) microshield structure with two bonded wafers and backside through-wafer etching [7]; (b) single-wafer frontside-etched microshield structure with vias on a thin membrane [8]; (c) single-wafer frontside-etched microshield structure without membrane; (d) suspended structure with/without dielectric support posts [21]; (e) fixed-fixed beam switch; and (f) down-state cantilever beam switch. and there is a wide variety of other RF microelectromechanical systems (MEMS) devices incorporating their structures, including LC passives [10], [11], filters [12], [13], power dividers [14], [15], mixers [16], [17], varactors [18], [19], couplers [20], [21], phase shifters [22], [23], resonators [24], [25], diplexers [24], oscillators [1], [24], parametric amplifiers [26], impedance tuners [27], [28], frequency selective surfaces [29], [30], and antennas [31], [32]. They can also take the form of moving beams to construct inline and shunt switches [22], [33], [34] as illustrated in Fig.…”

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confidence: 99%

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Skin-Effect Self-Heating in Air-Suspended RF MEMS Transmission-Line Structures

Chow

Wang²,

Jensen

et al. 2006

J. Microelectromech. Syst.

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Air-suspension of transmission-line structures using microelectromechanical systems (MEMS) technology provides the effective means to suppress substrate losses for radio-frequency (RF) signals. However, heating of these lines augmented by skin effects can be a major concern for RF MEMS reliability. To understand this phenomenon, a thermal energy transport model is developed in a simple analytical form. The model accounts for skin effects that cause Joule heating to be localized near the surface of the RF transmission line. Here, the model is validated through experimental data by measuring the temperature rise in an air-suspended MEMS coplanar waveguide (CPW). For this measurement, a new experimental methodology is also developed allowing direct current (dc) electrical resistance thermometry to be adopted in an RF setup. The modeling and experimental work presented in this paper allow us to provide design rules for preventing thermal and structural failures unique to the RF operation of suspended MEMS transmission-line components. For example, increasing the thickness from 1 to 3 m for a typical transmission line design enhances power handling from 5 to 125 W at 20 GHz, 3.3 to 80 W at 50 GHz, and 2.3 to 56 W at 100 GHz (a 25-fold increase in RF power handling). [1737] Index Terms-Coplanar waveguides (CPWs), failure analysis, microelectromechanical devices, skin effect, transmission lines. I. INTRODUCTION L OW-LOSS and low-dispersion transmission-line structures are critical components in radio-frequency (RF)/microwave circuit design. Air-suspended transmission-line structures, with their suspension above the commonly used complementary metal-oxide-semiconductor (CMOS) or GaAs substrates, can serve as fundamental building blocks to achieve low-loss, low-noise signal transmission for monolithic integration of RF circuits and devices [1]-[5]. They often form microshield transmission lines [6]-[9] as shown in Fig. 1(a)-(c),

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Section: Temperature and Rf Power Extractionmentioning

confidence: 99%

mentioning

confidence: 99%

Skin-Effect Self-Heating in Air-Suspended RF MEMS Transmission-Line Structures

Chow

Wang²,

Jensen

et al. 2006

J. Microelectromech. Syst.

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“…In [6] and [7] a reconfigurable coupler was proposed in waveguide technology, while in [8] a planar analog reconfigurable coupler employing varactors has been presented. In [9]- [11] different schemes of reconfigurable T-junctions have been proposed. However, even though in some applications the coupler plays the same role as a power divider, there are many others where these devices cannot be interchanged.…”

Section: Introductionmentioning

confidence: 99%

A novel reconfigurable coupler for intelligent SOP RF front-ends

Marcaccioli

Lugo²,

Tentzeris³

et al. 2005

2005 European Microwave Conference

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-A novel class of planar reconfigurable directional couplers for intelligent System on Package (SOP) RF front-ends is presented. Reconfigurability is obtained by modifying the electrical parameters of the coupled lines so as to tune the coupling ratio. RF switches such as MEMS or PIN diodes can be used to enable a wide range of reconfigurability in a very compact and low-loss device. The performance and the limitations of the coupler are discussed and design equations are provided. A hardwired prototype in microstrip technology has been manufactured. The novel concept introduced, however, is technology independent so that the reconfigurable coupler can be fabricated in microstrip, stripline or coplanar configurations.

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