RF/microwave characterization of multilayer ceramic-based MCM technology

Sutono, A.; Pham, Anh‐Vu; Laskar, J.; Smith, W. R.

doi:10.1109/6040.784480

Cited by 44 publications

(16 citation statements)

References 9 publications

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“…This paper will demonstrate that the low temperature co-fired ceramic (LTCC) technology can be successfully implemented for the fabrication of different multilayer high performance electronic components, assembled modules and systems (Shin et al, 2006;Heo et al, 2007;Jantunen et al, 2003;Sutono et al, 1999;Komulainen et al, 2007;Eun and Park, 2004;Devlin et al, 2001). The authors have already previously considered and investigated characteristics of various inductor designs fabricated in different technologies, as well as impact of geometrical and electrical parameters variation on inductor performances (Radosavljević et al, 2011a, b, c;Bak et al, 2008a, b;Mohan et al, 1999;Perrone et al, 2009) The authors offer performance comparison of one PCB and three LTCC meander type inductors fabricated on differently patterned substrate configurations.…”

Section: Introductionmentioning

confidence: 97%

Comparison of LTCC inductors on different substrate configurations with PCB inductor

Marić

Radosavljevic

Smetana

et al. 2013

Microelectronics International

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Purpose -This paper presents performance comparison of RF inductors with the same lateral geometry applying different substrate configurations. The purpose of presented research is to demonstrate and verify some advantages of low temperature co-fired ceramic (LTCC) technology in comparison to printed circuit board (PCB) technology based on the performance analysis of presented inductors in lower RF range. Design/methodology/approach -The presented inductors are meander structures fabricated in LTCC and PCB technology, with same line width and outer dimensions. Performance analysis of all configurations is based on measurement results and numerical simulations. Advantage of LTCC technology is demonstrated by application of substrate pattering in order to maintain and/or improve expected inductor performances. Findings -As expected, obtained results for the inductor with an air-gap show increase of the quality factor over 30 percent and widening of the operating frequency range by 50 percent when compared with the same LTCC structure without a gap. But what is more important the inductor with airgap embedded inside LTCC stack maintains efficiency when compared to PCB inductor. This fact offers possibility of integration good quality components inside LTCC stack and reduction of used chip space. Originality/value -Advantages of LTCC with respect to PCB design are demonstrated by efficiency increase of the proposed inductor configurations by means of design optimization relying on substrate pattering and incensement of the packaging density by embedding inductors. The presented findings are verified through consistency of measurement results and simulated data.

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Section: Introductionmentioning

confidence: 97%

Comparison of LTCC inductors on different substrate configurations with PCB inductor

Marić

Radosavljevic

Smetana

et al. 2013

Microelectronics International

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“…At present, the integral multilayer technologies such as multilayer low-temperature co-fired ceramics (LTCC) and multilayer ceramic integrated circuits (MCIC) are promising technologies for design flexibility and optimized integration, thus being studied actively to achieve complete SOC and SIP solutions, in which not only provide an excellent platform to mix analog, digital and RF technologies but also provide hermetic packages as part of the basic interconnect structure [2,3].…”

Section: Introductionmentioning

confidence: 99%

Influence of bond valence on microwave dielectric properties of (1-x)CaWO4-xLnNbO4 (Ln = Nd, Sm) solid solutions

Kim

2007

J Electroceram

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Microwave dielectric properties of (1-x)CaWO 4 -xLnNbO 4 (Ln=Nd, Sm) ceramics were investigated as a function of LnNbO 4 content (0.05≤×≤0.30). Solid solutions with scheelite structure were obtained with LnNbO 4 content up to x=0.3 of Ln=Nd and/or x=0.2 of Ln=Sm, respectively. The unit-cell volume was decreased with the increase of B-site bond valence. For the solid solutions, dielectric constant (K) was slightly increased with LnNbO 4 content and K of the specimens with NdNbO 4 was higher than that of SmNbO 4 . This result was due to the larger dielectric polarizability of NdNbO 4 (17.02 Å) than SmNbO 4 (16.75 Å). The quality factor (Qf) was dependent on the microstructure of the specimens. Temperature coefficient of resonant frequency (TCF) increased with the increase of LnNbO 4 content due to the decrease of the differences between A-site and B-site bond valence in ABO 4 scheelite.

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“…The newly developed low-temperature cofired ceramic (LTCC) technology can partially offer some benefits as compared to other established material technologies for these proposes [1][2][3][4][5][6][7][8][9][10][11]. However, the thermal conductivity of LTCC is only about 2.0 -3.0 W/m°C.…”

Section: Introductionmentioning

confidence: 99%

Frequency-dependent maximum average power-handling capabilities of single and edge-coupled microstrip lines on low-temperature co-fired ceramic (LTCC) substrates

Wang

Dong

Gan

2006

Int J RF and Microwave Comp Aid Eng

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The frequency-dependent maximum average power-handling capabilities (APHCs) of single and edge-coupled microstrip lines (MLs) on low-temperature co-fired ceramic (LTCC) substrates are investigated in this article. Although LTCCs have excellent high-frequency performance, the thermal conductivity is about 2.0 -3.0 W/m°C, which is much smaller than that of sapphires, alumina, silicon, and GaAs. The method used to predict the APHC is based on the calculated conductive and dielectric attenuation constants for different modes, and the proposed multilayer thermal model for the temperature rise. Numerical investigations are carried out to examine the effects of geometric and physical parameters on the wideband pulse responses and maximum APHC for single finite-ground thin-film and coupled MLs, respectively. Methodologies to enhance the power-handling capability which are useful in the design of high-density microstrip interconnects on or embedded in multi-layer LTCCs are proposed.

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RF/microwave characterization of multilayer ceramic-based MCM technology

Cited by 44 publications

References 9 publications

Comparison of LTCC inductors on different substrate configurations with PCB inductor

Comparison of LTCC inductors on different substrate configurations with PCB inductor

Influence of bond valence on microwave dielectric properties of (1-x)CaWO4-xLnNbO4 (Ln = Nd, Sm) solid solutions

Frequency-dependent maximum average power-handling capabilities of single and edge-coupled microstrip lines on low-temperature co-fired ceramic (LTCC) substrates

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