Robust and Low Cost TSV Backside Reveal for 2.5D Multi-Die Integration

Song, Changjian; Wang, Lei; Yang, Y. B.; Wang, Zhun; Zhang, Wenqi; Cao, Liqiang

doi:10.1109/ectc.2016.146

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Robust and Low Cost TSV Backside Reveal for 2.5D Multi-Die Integration

Cited by 3 publications

References 7 publications

MEMS WLCSP development using vertical interconnection

MEMS WLCSP development using vertical interconnection

A Novel Liner Formation Strategy for Double-sided Through-silicon-via (TSV) Process

A Scalable Network-on-Chip Microprocessor With 2.5D Integrated Memory and Accelerator

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