2021
DOI: 10.1109/led.2021.3089621
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Robust Binary Neural Network Operation From 233 K to 398 K via Gate Stack and Bias Optimization of Ferroelectric FinFET Synapses

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Cited by 25 publications
(19 citation statements)
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“…The retention characteristics (Figure. [4,6,8]. However, while the tHZO was greater than 3tIGZO, the erase was possible by applying a negative voltage pulse at the gate terminal, which agrees with the results obtained for the MFSM structure.…”
Section: Experiments and Resultssupporting
confidence: 86%
See 1 more Smart Citation
“…The retention characteristics (Figure. [4,6,8]. However, while the tHZO was greater than 3tIGZO, the erase was possible by applying a negative voltage pulse at the gate terminal, which agrees with the results obtained for the MFSM structure.…”
Section: Experiments and Resultssupporting
confidence: 86%
“…based FeFETs [1][2][3], FefinFETs [4][5][6], and FeTFTs [7,8] have paved the way for further scaling and monolithic 3D integration with thin-film transistors (TFTs). However, the TFTs with polycrystalline silicon channels suffer from retention degradation, high thermal budget, and mobility (µ) degradation [9].…”
Section: Introductionmentioning
confidence: 99%
“…The successful demonstrations of these devices can be further exploited to implement hardware ANNs. For example, a crossbar array using a three-terminal FeFET can form a basic building block for ANN, as shown in figure 12(a) [100][101][102]. Simultaneously, two-terminal devices using 2D ferroelectrics as the active layer can be integrated to realize the 1T1R structure, as shown in figure 12(b) [103].…”
Section: Challenges and Outlookmentioning
confidence: 99%
“…Further factors like endurance, latency, and negligible impact from random telegraph noise (RTN) enable HfO2-based ferroelectric memories, especially the FeFETs, as a prospective candidate for next-generation IMC applications [14][15][16][17][18]. Recent research on 28nm high-k metal gate (HKMG) FeFETs, and FefinFETs have enabled the use of deeply scaled memory devices for analog computing-in-memory (CIM) applications [19][20][21][22]. However, device-to-device (D2D) variations in deeply scaled FeFETs pose a severe threat to accurately executing analog vector-matrix multiplication operations.…”
Section: Introductionmentioning
confidence: 99%
“…However, device-to-device (D2D) variations in deeply scaled FeFETs pose a severe threat to accurately executing analog vector-matrix multiplication operations. Numerous efforts have been made to improve the ill-impact D2D variations in FeFETs [20,[22][23][24][25] for neuromorphic computing. One approach is to run online training of NNs with FeFETs as synapses due to their noise-tolerant nature [26][27][28][29].…”
Section: Introductionmentioning
confidence: 99%