Role of the Insulating Fillers in the Encapsulation Material on the Lateral Charge Spreading in HV-ICs

Imperiale, Ilaria; Reggiani, Susanna; Pavarese, Giuseppe; Gnani, Elena; Gnudi, A.; Baccarani, G.; Ahn, Woojin; Alam, Muhammad Ashraful; Varghese, D.; Hernandez-Luna, Alejandro; Nguyen, Luu; Krishnan, S.

doi:10.1109/ted.2016.2645080

Cited by 13 publications

(13 citation statements)

References 23 publications

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“…where σ0 is the pre-exponential term, Ea is the activation energy in eV, k is the Boltzmann constant and T is the temperature in Kelvin. Activation energies of 2.47 eV and 2.84 eV have been The conductivity of MC0 is larger than the MC1 one on the whole temperature range, indicating an increase of conductivity with filler content, which is consistent with the analysis reported in [12]. The increase of conductivity with filler content was explained by the fact that a finite interfacial region around the fillers may be characterized by a different mobility.…”

Section: Dielectric Analysissupporting

confidence: 86%

Characterization of dielectric properties and conductivity in encapsulation materials with high insulating filler contents

Cornigli

Reggiani

Gnudi

et al. 2018

IEEE Trans. Dielect. Electr. Insul.

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The properties of different molding-compound materials with high filler contents have been investigated in order to assess their electrical properties. The experimental part of the present work has been focused on dielectric spectroscopy and steady-state conduction measurements. The results have been used to investigate the electrical properties of the materials at different frequencies, temperatures and electric fields. Differences in the relaxation kinetics with increasing filler content have been found, which can be ascribed to the larger interface regions between the filler particles. In addition, the extracted conductivities show a hopping transport and different activation energies on the temperature range from 20 ºC to 190 ºC.

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Section: Dielectric Analysissupporting

confidence: 86%

Characterization of dielectric properties and conductivity in encapsulation materials with high insulating filler contents

Cornigli

Reggiani

Gnudi

et al. 2018

IEEE Trans. Dielect. Electr. Insul.

Self Cite

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“…The most common material for integrated circuits (IC) encapsulation is epoxy resins [131]. These properties differ among them because of the different formulations made to improve specific properties that enhance individual performances.…”

Section: Electrical Encapsulation Materialsmentioning

confidence: 99%

“…Incorporating fillers such as alumina, boron nitride, alumina nitride, or other ceramic powder increases the thermal conductivity of the encapsulation's electrical insulation [129]. The inorganic filler reaches 65% to 90% of the total weight [131]. In recent Nowadays, the focus is on developing insulating cables with unique properties capable of operating at high temperatures and electric stress levels.…”

Section: Electrical Encapsulation Materialsmentioning

confidence: 99%

“…Incorporating fillers such as alumina, boron nitride, alumina nitride, or other ceramic powder increases the thermal conductivity of the encapsulation's electrical insulation [129]. The inorganic filler reaches 65% to 90% of the total weight [131]. In recent years the incorporation of microscale and nanoscale insulating fillers in epoxy resins has been studied to increase the mechanical stress resistance and increase the dielectric strength [133][134][135].…”

Section: Electrical Encapsulation Materialsmentioning

confidence: 99%

“…In recent years the incorporation of microscale and nanoscale insulating fillers in epoxy resins has been studied to increase the mechanical stress resistance and increase the dielectric strength [133][134][135]. Those investigations had shown that increasing the filler content increased the current conduction and volume conductivity, a conclusion that was not expected given the nature of the inorganic fillers [131]. This hint that the epoxy/filler intermolecular interaction could be directly related to the bulk transportation capabilities [131].…”

Section: Electrical Encapsulation Materialsmentioning

confidence: 99%

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Application and Suitability of Polymeric Materials as Insulators in Electrical Equipment

et al. 2021

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In this paper, the applications of thermoplastic, thermoset polymers, and a brief description of the functions of each subsystem are reviewed. The synthetic route and characteristics of polymeric materials are presented. The mechanical properties of polymers such as impact behavior, tensile test, bending test, and thermal properties like mold stress-relief distortion, generic thermal indices, relative thermal capability, and relative thermal index are mentioned. Furthermore, this paper covers the electrical behavior of polymers, mainly their dielectric strength. Different techniques for evaluating polymers’ suitability applied for electrical insulation are covered, such as partial discharge and high current arc resistance to ignition. The polymeric materials and processes used for manufacturing cables at different voltage ranges are described, and their applications to high voltage DC systems (HVDC) are discussed. The evolution and limitations of polymeric materials for electrical application and their advantages and future trends are mentioned. However, to reduce the high cost of filler networks and improve their technical properties, new techniques need to be developed. To overcome limitations associated with the accuracy of the techniques used for quantifying residual stresses in polymers, new techniques such as indentation are used with higher force at the stressed location.

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Electrical characterization of epoxy-based molding compounds for next generation HV ICs in presence of moisture

Cornigli

Reggiani

Gnudi

et al. 2018

Microelectronics Reliability

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Role of the Insulating Fillers in the Encapsulation Material on the Lateral Charge Spreading in HV-ICs

Cited by 13 publications

References 23 publications

Characterization of dielectric properties and conductivity in encapsulation materials with high insulating filler contents

Characterization of dielectric properties and conductivity in encapsulation materials with high insulating filler contents

Application and Suitability of Polymeric Materials as Insulators in Electrical Equipment

Electrical characterization of epoxy-based molding compounds for next generation HV ICs in presence of moisture

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