2018
DOI: 10.1002/admt.201800486
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Rolled‐up Nanotechnology: Materials Issue and Geometry Capability

Abstract: chemical vapor deposition (CVD). When it comes to on-chip integrations, these strategies are limited by accessible materials and slow processing rate, [31] and the generated defects in the produced amorphous materials placed restrictions to its further applications in high-performance devices. [32] Therefore, novel approaches and methods of fabricating 3D micro/ nanostructures are highly demanded.Rolled-up nanotechnology is an alternative technique that fabricates 3D nanostructures out of planar films called n… Show more

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Cited by 47 publications
(37 citation statements)
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References 261 publications
(448 reference statements)
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“…With the help of compatible lithographic techniques and, more importantly, development of novel lithographically processable strain‐engineering materials and composites, the self‐assembly of micro‐ and nanoscale 3D architectures can be obtained by the shaping of initially planar structures . These shapeable material technologies have already demonstrated (Figure b) the capability to self‐assemble planar films into a number of different complex polygonal structures and tubular “Swiss‐rolls.”…”
Section: Introductionmentioning
confidence: 99%
“…With the help of compatible lithographic techniques and, more importantly, development of novel lithographically processable strain‐engineering materials and composites, the self‐assembly of micro‐ and nanoscale 3D architectures can be obtained by the shaping of initially planar structures . These shapeable material technologies have already demonstrated (Figure b) the capability to self‐assemble planar films into a number of different complex polygonal structures and tubular “Swiss‐rolls.”…”
Section: Introductionmentioning
confidence: 99%
“…Complex 3D functional systems are of widespread interest due to their potential applications in areas ranging from biomedical devices and metamaterials to electronic platforms . Although fabrication techniques based on 3D printing, templated growth, and controlled folding/rolling are useful in many contexts, each has limitations in materials compatibility, accessible feature size or, most critically, alignment with state‐of‐the‐art 2D processing techniques used in the semiconductor industry. A portfolio of recently presented methods allow geometric transformation of such 2D systems (referred to here as 2D precursors) into 3D structures by the action of compressive forces delivered at precisely defined locations via a prestretched silicone elastomer substrate .…”
Section: Introductionmentioning
confidence: 99%
“…The materials and techniques necessary for self‐assembly on the mesoscopic scale has progressed rapidly over the last two decades, and it has certainly experienced an increased level of interest in the past few years as is evident from the recent proliferation of reviews on the topic . The techniques associated with self‐assembled devices as well as their material platforms are reviewed in this section to bring the various parts of the self‐assembly toolbox to the readers' attention.…”
Section: D Self‐assembled Microelectronic Technologies and Materialsmentioning
confidence: 99%