Runtime Thermal Management Using Software Agents for Multi- and Many-Core Architectures

Faruque, Mohammad Abdullah Al; Jahn, Janmartin; Ebi, Thomas; Henkel, Jörg

doi:10.1109/mdt.2010.94

Cited by 40 publications

(17 citation statements)

References 11 publications

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“…An OS-level technique for job scheduling is proposed in [28]. Thermal aging is addressed in [29]. The thermal impacts of the adjacent cores on the thermal profile is considered in [30].…”

Section: B Power and Thermal Managementmentioning

confidence: 99%

TheSPoT: Thermal Stress-Aware Power and Temperature Management for Multiprocessor Systems-on-Chip

Iranfar

Kamal

Afzali-Kusha

et al. 2018

IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst.

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Abstract-Thermal stress including temperature gradients in time and space, as well as thermal cycling, influences lifetime reliability and performance of modern Multiprocessor Systemson-Chip (MPSoCs). Conventional power and temperature management techniques considering the peak temperature/power consumption do not provide a comprehensive solution to avoid high spatial and temporal thermal variations. This work presents TheSPoT, a novel multi-level thermal stress-aware power and thermal management approach for MPSoCs. At the top level, core consolidation and deconsolidation is performed based on peak temperature, thermal stress, and power consumption constraints. These constraints are also used at the next level, where operating frequencies are determined. At this level we obtain optimal core frequencies by solving a convex optimization problem. However, thereafter, to reduce the runtime overhead in large MPSoCs, we alternatively propose to use a fast heuristic algorithm. The efficacy of the proposed approaches in reducing the thermal cycles and temporal/spatial temperature gradients is evaluated by comparing the results with the state-of-the-art methods. The evaluation performed on 4-core, 8-core, and 16-core MPSoCs, using PARSEC benchmarks, reveals a considerable reduction in thermal stress. For the 8-core MPSoC case study, on average, for the proposed heuristic(optimal) approach, the mean time to failure improved by 47(35) % compared to the state-of-the-art techniques with only 6(4) % performance degradation. Also, our simulations show that TheSPoT is more efficient in thermal stress reduction when more heterogeneous workloads are used.

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“…An OS-level technique for job scheduling is proposed in [28]. Thermal aging is addressed in [29]. The thermal impacts of the adjacent cores on the thermal profile is considered in [30].…”

Section: B Power and Thermal Managementmentioning

confidence: 99%

TheSPoT: Thermal Stress-Aware Power and Temperature Management for Multiprocessor Systems-on-Chip

Iranfar

Kamal

Afzali-Kusha

et al. 2018

IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst.

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“…A number of researches have proposed some proactive techniques such as thread scheduling, thread mapping, shutting-down schemes, and migration policies to reduce the power consumption in multicore systems [26][27][28][29][30]. However, these approaches limit their scope only to cores.…”

Section: Related Workmentioning

confidence: 99%

A novel power model for future heterogeneous 3D chip-multiprocessors in the dark silicon age

2018

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Dark silicon has recently emerged as a new problem in VLSI technology. Maximizing performance of chip-multiprocessors (CMPs) under power and thermal constraints is very challenging in the dark silicon era. Providing next-generation analytical models for future CMPs which consider the impact of power consumption of core and uncore components such as cache hierarchy and on-chip interconnect that consume significant portion of the on-chip power consumption is largely unexplored. In this article, we propose a detailed power model which is useful for future CMP power modeling. In the proposed architecture for future CMPs, we exploit emerging technologies such as non-volatile memories (NVMs) and 3D techniques to combat dark silicon. Results extracted from the simulations are compared with those obtained from the analytical model. Comparisons show that the proposed model accurately estimates the power consumption of CMPs running both multi-threaded and multi-programed workloads.

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“…Due to scalability problems of centralized control, an agent-based thermal management technique is proposed in [2]. Finally, a hierarchical power management technique for asymmetric processors is presented in [35], where the authors try to optimize the energy/performance trade-off un- to few examples such as simple XScale core and Alpha processor [19,39].…”

Section: Related Workmentioning

confidence: 99%

Predictive Dynamic Thermal and Power Management for Heterogeneous Mobile Platforms

Singla

Kaur

Unver

et al. 2015

Design, Automation &Amp; Test in Europe Conference &Amp; Exhibition (DATE), 2015

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Heterogeneous multiprocessor systems-on-chip (MPSoCs) powering mobile platforms integrate multiple asymmetric CPU cores, a GPU, and many specialized processors. When the MPSoC operates close to its peak performance, power dissipation easily increases the temperature, hence adversely impacts reliability. Since using a fan is not a viable solution for hand-held devices, there is a strong need for dynamic thermal and power management (DTPM) algorithms that can regulate temperature with minimal performance impact. This abstract presents a DTPM algorithm based on a practical temperature prediction methodology using system identification. The DTPM algorithm dynamically computes a power budget using the predicted temperature, and controls the types and number of active processors as well as their frequencies. Experiments on an octa-core big.LITTLE processor and common Android apps demonstrate that the proposed technique predicts temperature within 3% accuracy, while the DTPM algorithm provides around 6× reduction in temperature variance, and as large as 16% reduction in total platform power compared to using a fan. Ogras, who not only taught and motivated me to pursue research, but also helped me achieve certain level of confidence and maturity. Without his valuable time, support and guidance, I could not have finished this work. I would also like to thank Dr. Bertan Bakkaloglu and Dr. Ali Unver for taking out time and agreeing to be a part of my thesis defense committee.

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Runtime Thermal Management Using Software Agents for Multi- and Many-Core Architectures

Cited by 40 publications

References 11 publications

TheSPoT: Thermal Stress-Aware Power and Temperature Management for Multiprocessor Systems-on-Chip

TheSPoT: Thermal Stress-Aware Power and Temperature Management for Multiprocessor Systems-on-Chip

A novel power model for future heterogeneous 3D chip-multiprocessors in the dark silicon age

Predictive Dynamic Thermal and Power Management for Heterogeneous Mobile Platforms

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