1994
DOI: 10.1007/bf01250732
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Scaling of MOS technology to submicrometer feature sizes

Abstract: Industries based on MOS technology now play a prominent role in t he developed and the developing world. j\fore importantly, MOS techn ology drives a large proportion of innovation in many technologies . It is likely th at the course of technological development depends more on the capability of MOS technology than on any other technical factor . T herefore, it is worthwhile investigating the na.ture and limits of future improvements to MOS fabrication. The key to improved MOS technology is r eduction in featu… Show more

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Cited by 53 publications
(23 citation statements)
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“…The initial silicon was then doped with boron with a concentration of 1 x 10 14 atom/cm 3 . The formation of BOX was done by depositing 40 nm oxide thickness (tBOX).…”
Section: Process and Device Structurementioning
confidence: 99%
See 1 more Smart Citation
“…The initial silicon was then doped with boron with a concentration of 1 x 10 14 atom/cm 3 . The formation of BOX was done by depositing 40 nm oxide thickness (tBOX).…”
Section: Process and Device Structurementioning
confidence: 99%
“…High leakage current (IOFF) in nano-scale regimes is becoming a significant contributor to the power dissipation of the MOSFET device [2]. This increase in IOFF is typically due to the charge-sharing effect caused by drain-induced barrier lowering (DIBL) or due to deep channel punchthrough currents [3]. As the channel width decreases, both the threshold voltage (VTH) and leakage current (IOFF) will be modulated by the width of the transistor, giving rise to a significant narrow-width effect.…”
Section: Introductionmentioning
confidence: 99%
“…Additionally, a dense network of such transistors could be slowed down by the flow of current through extremely narrow wires from one device to the next. Detailed treatments of the fundamental limitations upon small electronic circuitry [4]- [9], [49] and of the scaling problem for FET's may be found elsewhere in the literature [39], [109], including this issue of the Proceedings [43], [171].…”
Section: B Obstacles To Further Miniaturization Of Fet'smentioning
confidence: 99%
“…We fit these data with an FN fit [16,22]: where lg is the gate current; V ox is the oxide voltage; Vt = 928V is consistent with a recent survey [18] of Si0 2 tunneling, given the 350A gate oxide; and <p is a fit parameter. We also show an empirical fit , in which we add a built-in potential, Vbi, to the FN equation, to fit the experimental data more closely: ( 14.3) where {-Vii , and V 0 are fit constants.…”
Section: The Tunneling Equationmentioning
confidence: 99%
“…We typically operate the synapses in their subthreshold regime (18], and select either drain current or source current as the synapse output. We choose subthreshold operation for three reasons.…”
Section: The Synapsesmentioning
confidence: 99%