Scheduling Cluster Tools in Semiconductor Manufacturing: Recent Advances and Challenges

Pan, Chunrong; Zhou, MengChu; Qiao, Yan; Wu, Naiqi

doi:10.1109/tase.2016.2642997

Cited by 94 publications

(21 citation statements)

References 146 publications

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“…3. Research on more scheduling and rescheduling problems in some special fields, e.g., semiconductor manufacturing [44], [45] and steel production [46] 4. Develop new local search heuristics based on problem features and ensembles of different local searchers to improve the performance of algorithms.…”

Section: Discussionmentioning

confidence: 99%

Improved Jaya Algorithm for Flexible Job Shop Rescheduling Problem

Gao

Yang

et al. 2020

IEEE Access

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Machine recovery is met from time to time in real-life production. Rescheduling is often a necessary procedure to cope with it. Its instability gauges the number of changes to the existing scheduling solutions. It is a key criterion to measure a rescheduling solution's quality. This work aims at solving a flexible job shop problem with machine recovery, which arises from the scheduling and rescheduling of pump remanufacturing systems. In their scheduling phase, the objective is to minimize makespan. In their rescheduling phase, two objectives are to minimize both instability and makespan. By introducing two novel local search operators into the original Jaya algorithm, this work proposes an improved Jaya algorithm to solve it. It performs experiments on ten different-scale cases of real-life remanufacturing environment. The results show that the improved Jaya is effective and efficient for solving a flexible job shop scheduling and rescheduling problems. It can effectively balance instability and makespan in a rescheduling phase. INDEX TERMS Jaya algorithm, flexible job shop scheduling, machine recovery, remanufacturing, scheduling and rescheduling.

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Section: Discussionmentioning

confidence: 99%

Improved Jaya Algorithm for Flexible Job Shop Rescheduling Problem

Gao

Yang

et al. 2020

IEEE Access

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“…It translated the problem to a multiple target visiting problem. The multiple targets visiting problem was transformed to a TSP [10]. The work considered the limited energy and time budget, however it failed to take into consideration the correlated nature of work.…”

Section: Related Workmentioning

confidence: 99%

“…The recent [9] agent based fixed altitude CPP problem mapped the environment monitoring problem as a multiple target visiting problem. The multiple targets visiting problem was then formulated as Travelling Salesman Problem (TSP) [10]. TSP generated an optimal path, where each target was visited once taking into consideration disjoint regions, however ignoring the constraint of correlated nature of work.…”

Section: Introductionmentioning

confidence: 99%

Coverage Path Planning Techniques for Inspection of Disjoint Regions With Precedence Provision

et al. 2021

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“…Considering their vast investment and production cost, it is of great importance to seek efficient and practical scheduling and control methodologies for cluster tools [1]. However, there is so far no generic solution due to coupling constraints.…”

Section: Introductionmentioning

confidence: 99%

Transient Process Optimization for Dual-Arm Cluster Tools With Wafer Revisiting

Wang

Pan

et al. 2021

IEEE Access

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In wafer fabrication, it is imperative to minimize the transient process of cluster tools for the sake of on-demand and preventive maintenance. Due to the trend of multi-type and small-batch production, transient processes appear more and more frequently. Thus, the optimization problems of transient processes have gained increasing attention from both industry and academia. The requirement for wafer revisiting tend to complicate this problem significantly. However, only a few studies take such a challenge for cluster tools with wafer revisiting. This paper focuses on the schedule optimization of transient processes for dual-arm cluster tools with wafer revisiting. To accelerate transient processes, including both start-up and close-down ones, we adopt a program evaluation and review technique to analyze and harness a cluster tool's state evolution. We then propose computationally efficient algorithms to speed up transient processes. Finally, we provide illustrative examples to show their applications and validate their effectiveness.INDEX TERMS Cluster tool, semiconductor manufacturing, wafer fabrication, scheduling, transient process, wafer revisiting.{0}. PM Process module. SACT Single-arm cluster tool. DACT Dual-arm cluster tool. ALD Atomic layer deposition. WRP Wafer revisiting process. k-WRP k-time Wafer revisiting process. 1-WCS One-wafer cyclic scheduling. 3-WCS Three-wafer cyclic scheduling. VWM Virtual wafer method. SUTP Start-up transient process. CDTP Close-down transient process. PERT Program evaluation and review technique.

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Scheduling Cluster Tools in Semiconductor Manufacturing: Recent Advances and Challenges

Cited by 94 publications

References 146 publications

Improved Jaya Algorithm for Flexible Job Shop Rescheduling Problem

Improved Jaya Algorithm for Flexible Job Shop Rescheduling Problem

Coverage Path Planning Techniques for Inspection of Disjoint Regions With Precedence Provision

Transient Process Optimization for Dual-Arm Cluster Tools With Wafer Revisiting

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