Self-Actuating Isothermal Nanomechanical Test Platform for Tensile Creep Measurement of Freestanding Thin Films

Ni, Longchang; Boer, Maarten P. de

doi:10.1109/jmems.2021.3131153

Cited by 6 publications

(5 citation statements)

References 48 publications

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“…The crack propagation speed in AlSi was roughly 1/10 of that in pure Al. Except for those Al alloys like AlCu [108], various types of metallic film materials on a micro/nm scale have been evaluated so far, such as pure Al [109], Cu [110], Au [111][112][113][114], Ni [115,116], Ti [116], SnAu [117,118], and TiN [6,7], for mechanical reliability investigation as MEMS materials. Electroplated Ni turns on MEMS researchers from the viewpoint of a promising material for a 3D mechanical element made by using UV-LIGA process [21,[119][120][121][122].…”

Section: Metalsmentioning

confidence: 99%

Section: Materials Characteristicsmentioning

confidence: 99%

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Mechanical Property Measurement of Micro/Nanoscale Materials for MEMS: A Review

Namazu

2022

IEEJ Transactions Elec Engng

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By virtue of a great progress of semiconductor fabrication technologies, micro electro‐mechanical systems (MEMS) have been developed for a wide variety of industries. For reliability of MEMS, micromaterials in MEMS need to be examined experimentally, and the obtained results need to be reflected in the design of MEMS. In addition, with the benefit of such the MEMS technology, nowadays mechanical characteristics of nanomaterials have been evaluated precisely. Nanoscale mechanical testing provides an opportunity to find new unique physical phenomena, such as plastic deformation in Si at intermediate temperatures. In this review paper, mechanical testing technologies developed for investigating micro and nanoscale materials are reviewed. Then, mechanical characteristics of Si and other materials evaluated using the micro and nano mechanical testing technologies are introduced. © 2022 Institute of Electrical Engineers of Japan. Published by Wiley Periodicals LLC.

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Section: Metalsmentioning

confidence: 99%

Section: Materials Characteristicsmentioning

confidence: 99%

Mechanical Property Measurement of Micro/Nanoscale Materials for MEMS: A Review

Namazu

2022

IEEJ Transactions Elec Engng

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“…In [5], the authors conducted a thermal-mechanical-stress simulation; and the gold cantilever shows deformation caused by the thermal-mechanical stress. Meanwhile, creep effects caused by viscoelasticity have been also studied in metal MEMS structures, such as microbeam [6], microbridge [7,8], films [9][10][11], laterally actuators [12], and so on. In [6], the authors used a nanoindenter to test the creep of the nickel cantilever.…”

Section: Introductionmentioning

confidence: 99%

“…In [9,10], the author characterized the nickel RF-MEMS devices through a highly accurate capacitance-sensing setup under a special bi-state bias condition, and the model reveals that the creep deformation is dominated by Coble creep. In [11], the authors focus on the creep performance of gold and evaluated the uniaxial Au tensile specimens by a special MEMS structure, and their work demonstrates a powerful driftfree nanomechanical test platform for mechanical property measurement of freestanding thin films subjected to uniaxial tension. In [12], the authors conducted the analysis of thermomechanical coupling damage behavior in the long-term performance of MEMS actuators.…”

Section: Introductionmentioning

confidence: 99%

“…Meanwhile, in the previous studies, the methods for the test of the thermal-mechanicalstress effects and creep effects in MEMS structures include direct methods, such as microtension [11,13,14], nanoindentation [6,15], and indirect methods, such as optical curvature [4,16,17], voltage [18][19][20], capacitance [9,10,21], and so on. However, these methods are not suitable for DC-contact RF MEMS switches.…”

Section: Introductionmentioning

confidence: 99%

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Modeling and Measurement of Thermal–Mechanical-Stress-Creep Effect for RF MEMS Switch Up to 200 °C

Sun

Liu

2022

Micromachines

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High-temperature processes, such as packaging and annealing, are challenges for Radio-Frequency Micro-Electro-Mechanical-Systems (RF MEMS) structures, which could lead to device failure. Coefficient of thermal expansion (CTE) mismatch and the material’s creep effect affect the fabrication and performance of the MEMS, especially experiencing the high temperature. In this paper, the Thermal–Mechanical-Stress-Creep (TMSC) effect during thermal processes from room temperature (RT) to 200 °C is modeled and measured, in which an Au-cantilever-based RF MEMS switch is selected as a typical device example. A novel Isolation-Test Method (ITM) is used to measure precise TMSC variation. This method can achieve resolutions of sub-nanometer (0.5 nm) and attofarad (1 aF). There are three stages in the thermal processes, including temperature ramping up, temperature dwelling, and temperature ramping down. In different stages, the thermal–mechanical stress in anchor and cantilever, the grain growth of gold, and the thermal creep compete with each other, which result in the falling down and curling up of the cantilever. These influencing factors are decoupled and discussed in different stages. The focused ion beam (FIB) is used to characterize the change of the gold grain. This study shows the possibility of predicting the deformation of MEMS structures during different high-temperature processes. This model can be extended for material selection and package temperature design of MEMS cantilever in the further studies.

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