Self-anchoring nickel microelectrodes for rapid fabrication of functional thermoplastic microfluidic prototypes

Paredes, Jacobo; Fink, Kathryn; Novak, Richard M.; Liepmann, Dorian

doi:10.1016/j.snb.2015.04.041

Cited by 5 publications

(4 citation statements)

References 36 publications

(40 reference statements)

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“…Other important parameters that can be considered include the life span, cyclic stability, environmental impact, and, in the case of further commercialization, the technology readiness level, production costs, and manufacturing complexity. Recent developments in rapid prototyping for electronics, MEMS, and microfluidics [ 270,271 ] have provided various new possibilities for manufacturing TCDs relatively inexpensively.…”

Section: Resultsmentioning

confidence: 99%

Fluidic and Mechanical Thermal Control Devices

Klinar

Swoboda

Rojo

et al. 2020

Adv Elect Materials

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In recent years, intensive studies on thermal control devices have been conducted for the thermal management of electronics and computers as well as for applications in energy conversion, chemistry, sensors, buildings, and outer space. Conventional cooling or heating techniques realized using traditional thermal resistors and capacitors cannot meet the thermal requirements of advanced systems. Therefore, new thermal control devices are being investigated to satisfy these requirements. These devices include thermal diodes, thermal switches, thermal regulators, and thermal transistors, all of which manage heat in a manner analogous to how electronic devices and circuits control electricity. To design or apply these novel devices as well as thermal control principles, this paper presents a systematic and comprehensive review of the state‐of‐the‐art of fluidic and mechanical thermal control devices that have already been implemented in various applications for different size scales and temperature ranges. Operation principles, working parameters, and limitations are discussed and the most important features for a particular device are identified.

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Section: Resultsmentioning

confidence: 99%

Fluidic and Mechanical Thermal Control Devices

Klinar

Swoboda

Rojo

et al. 2020

Adv Elect Materials

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“…Alternatively, molds may also be micro-machined from metal substrates such as copper, nickel, aluminum and brass [ 9 , 10 , 11 , 12 , 13 , 14 , 15 , 16 ]. Metal molds can be fabricated using conventional computer numerical control (CNC) machines and retain the accuracy of features over many more molding cycles compared to molds created by photo lithography because photoresist molds are relatively easily damaged [ 17 ] and have limited life cycles: 10 cast and peel off cycles in the case of the PDMS device [ 18 ] and <5 cycles in some cases such as hot embossing [ 19 ] with silicon as the substrate material; however, the SU8 mold pattern created over the thick copper substrate increased the molding cycles at least 40-fold [ 20 ], whereas the metal mold could retain the structure after a number of cycles [ 21 ].…”

Section: Introductionmentioning

confidence: 99%

Study on the Optimum Cutting Parameters of an Aluminum Mold for Effective Bonding Strength of a PDMS Microfluidic Device

Yousuff

Danish

et al. 2017

Micromachines

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Master mold fabricated using micro milling is an easy way to develop the polydimethylsiloxane (PDMS) based microfluidic device. Achieving high-quality micro-milled surface is important for excellent bonding strength between PDMS and glass slide. The aim of our experiment is to study the optimal cutting parameters for micro milling an aluminum mold insert for the production of a fine resolution microstructure with the minimum surface roughness using conventional computer numerical control (CNC) machine systems; we also aim to measure the bonding strength of PDMS with different surface roughnesses. Response surface methodology was employed to optimize the cutting parameters in order to obtain high surface smoothness. The cutting parameters were demonstrated with the following combinations: 20,000 rpm spindle speed, 50 mm/min feed rate, depth of cut 5 µm with tool size 200 µm or less; this gives a fine resolution microstructure with the minimum surface roughness and strong bonding strength between PDMS–PDMS and PDMS–glass.

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“…At present, many electrode materials, such as polymers [7], metals [8], carbon nanotubes [9], and graphene [10] have been successfully implemented and used in academic applications. Although the integration of polymers with large-scale fabrication techniques have given remarkable results [11,12], a method of bonding microfluidic chips with integrated electrodes effectively and compatibly with production standards is yet to be found. …”

Section: Introductionmentioning

confidence: 99%

Comparison of Ultrasonic Welding and Thermal Bonding for the Integration of Thin Film Metal Electrodes in Injection Molded Polymeric Lab-on-Chip Systems for Electrochemistry

Matteucci¹,

Heiskanen²,

Zór³

et al. 2016

Sensors

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We compare ultrasonic welding (UW) and thermal bonding (TB) for the integration of embedded thin-film gold electrodes for electrochemical applications in injection molded (IM) microfluidic chips. The UW bonded chips showed a significantly superior electrochemical performance compared to the ones obtained using TB. Parameters such as metal thickness of electrodes, depth of electrode embedding, delivered power, and height of energy directors (for UW), as well as pressure and temperature (for TB), were systematically studied to evaluate the two bonding methods and requirements for optimal electrochemical performance. The presented technology is intended for easy and effective integration of polymeric Lab-on-Chip systems to encourage their use in research, commercialization and education.

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Self-anchoring nickel microelectrodes for rapid fabrication of functional thermoplastic microfluidic prototypes

Cited by 5 publications

References 36 publications

Fluidic and Mechanical Thermal Control Devices

Fluidic and Mechanical Thermal Control Devices

Study on the Optimum Cutting Parameters of an Aluminum Mold for Effective Bonding Strength of a PDMS Microfluidic Device

Comparison of Ultrasonic Welding and Thermal Bonding for the Integration of Thin Film Metal Electrodes in Injection Molded Polymeric Lab-on-Chip Systems for Electrochemistry

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