Nano-floating gate memory devices were fabricated by using nickel nanocrystals as a charge-trapping portion embedded into Al 2 O 3 thin films. Ni nanocrystals were prepared via a thermal reduction of nanoscale NiO layers deposited by atomic layer deposition. Although the continuous deposition of insulating Al 2 O 3 and semiconducting NiO thin films allowed the facile fabrication of charge-trap, the corresponding retention feature suffers from inferior charge trapping/detrapping. On the other hand, the Ni nanocrystals enhanced the retention behavior and exhibited the largest memory window of 13.8 V with the stored charge density of 2.5 Â 10 13 traps/cm 2 , probably due to the isolated formation of charge-trapping centers.Next-generation non-volatile memories will have to meet stringent device performance requirements, such as higher speed, enhanced data storage density, limited device space, and lower power consumption, in addition to possessing nonvolatile features in data storage mode. In particular, nano-floating gate memories (NFGMs) are the dominant type of memory compared to their current competitors, such as phase-change random access memories (RAMs), resistive RAMs, polymer RAMs, magnetic RAMs etc. 1-7 NFGM performance far exceeds the currently-evolved flash memories and dynamic random access memories in terms of operation voltage, consumption power, and data volatility. Further, NFGMs can be effectively adapted to the pre-existing Si processing/technology through the incorporation of sophisticated thin dielectric layers. The performance of NFGMs depends largely upon the delicate function of the charge-trapping materials embedded into the high-k thin films. Furthermore, NFGMs should meet stringent requirements of nonvolatile memories: fast programming/erasing speed, high-number programming/easing cycles, and long-period charge retention.A typical strategy is to combine high-k dielectric materials (Al 2 O 3 , ZrO 2 , HfO 2 , etc. 8-22 ) with metallic and semiconducting nanocrystals such as Pt, Au, Co, Ge, Ni, and silicides. In particular, Ni-based nanocrystals were attempted in the combined form of physical deposition and post thermal treatments. 18-23 The formation of charge-trapping nanocrystals has been shown through physical and chemical deposition of metallic or semiconducting layers followed by thermal or optical annealing or chemical dispersion of nanocrystals onto the dielectric thin films. Those approaches suffer from the disadvantage that processing is discontinuous, while facile continuous processing would be preferred.Since the introduction of atomic layer deposition (ALD) by Suntola, 24 ALD has been gaining widespread attention in semiconductors and flat-panel displays, owing to conformal coverage in lowdimensional structures, superior control in film thickness and robust dielectrics. ALD was employed to continuously deposit insulating and charge-trapping layers without any process interruptions. 25 A semiconducting oxide, such as nickel oxide (NiO), has been proposed as a candidate for charge-...