SerDes chips for 100Gbps Dual-Polarization DQPSK

Chung, Kun-Wook; Steidl, S.A.; Krawczyk, T.W.; Miller, R.H.; Shang, Song; Mohiuddin, Taqi; Cormier, Jay; Hornbuckle, Craig

doi:10.1364/nfoec.2009.jwa91

Cited by 4 publications

(2 citation statements)

References 3 publications

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“…In next generation high-speed communication systems such as Ethernet or SONET (Synchronous Optical NETwork), high-speed chips with data rates of more than 100 Gbps are required [7][8][9]. Additionally, high-speed data processing modules such as SerDes (Serialization and De-serialization) require a several 10s of Gbps data rate in SIP or PCB (printed circuit board) level (i.e., outside of chips).…”

Section: Introductionmentioning

confidence: 99%

Experimental Characterization and Signal Integrity Verification of Interconnect Lines with Inter-layer Vias

Kim¹,

Kim²,

Eo³

2011

JSTS:Journal of Semiconductor Technology and Science

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Interconnect lines with inter-layer vias are experimentally characterized by using high-frequency S-parameter measurements. Test patterns are designed and fabricated using a package process. Then they are measured using Vector Network Analyzer (VNA) up to 25 GHz. Modeling a via as a circuit, its model parameters are determined. It is shown that the circuit model has excellent agreement with the measured S-parameters. The signal integrity of the lines with inter-layer vias is evaluated by using the developed circuit model. Thereby, it is shown that via may have a substantially deteriorative effect on the signal integrity of high-speed integrated circuits.

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Section: Introductionmentioning

confidence: 99%

Experimental Characterization and Signal Integrity Verification of Interconnect Lines with Inter-layer Vias

Kim¹,

Kim²,

Eo³

2011

JSTS:Journal of Semiconductor Technology and Science

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“…There have been many debates over which modulation format is the most appropriate for use in the 100 Gb/s serial data transmission service of optical transport interfaces. These formats include ASK NRZ VSB, NRZ-DPSK, CSRZ-DPSK, RZ-DQPSK, and others [3,4,5].…”

Section: Introductionmentioning

confidence: 99%

De-multiplexing of 107 Gb/s OTDM signal based on pulsed pump optical parametric amplifier

Karásek

Honzátko

2010

2010 12th International Conference on Transparent Optical Networks

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We present experimental results on de-multiplexing 107 Gb/s OTDM signal using pulsed pump fiber optical parametric amplifier (FOPA). Basic train of 13.375 GHz RZ pulses which serves for generation of the 107 Gb/s signal and 13.375 GHz pump were derived from one mode locked laser diode with saturable absorber. Pump pulses for FOPA were generated in a wavelength converter based on XPM in HNLF and phase to amplitude conversion in fiber Bragg grating.

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Design of a 12.5 GS/s 5-bit folding A/D converter

Surano

Maloberti

2010

2010 First IEEE Latin American Symposium on Circuits and Systems (LASCAS)

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SerDes chips for 100Gbps Dual-Polarization DQPSK

Abstract: The required features of SerDes chips for 100Gbps Ethernet and OTN optical data transmission are discussed. As a baseline technology for 100Gbps SerDes, 40Gbps DPQSK serializer chip performance is presented.(

Cited by 4 publications

References 3 publications

Experimental Characterization and Signal Integrity Verification of Interconnect Lines with Inter-layer Vias

Experimental Characterization and Signal Integrity Verification of Interconnect Lines with Inter-layer Vias

De-multiplexing of 107 Gb/s OTDM signal based on pulsed pump optical parametric amplifier

Design of a 12.5 GS/s 5-bit folding A/D converter

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