2000
DOI: 10.1109/66.857945
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SHEWMA: an end-of-line SPC scheme using wafer acceptance test data

Abstract: In this paper, an end-of-line quality control scheme based on wafer acceptance test (WAT) data is presented. Due to the multiple-stream and sequence-disorder effects typically present in the WAT data, an abnormal process shift caused by one machine at an in-line step may become vague for detection using end-of-line WAT data. A methodology for generating robust design parameters for the simultaneous application of Shewhart and EWMA control charts to WAT data is proposed. This SHEWMA scheme is implemented in a f… Show more

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Cited by 19 publications
(5 citation statements)
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“…which is an unbiased estimate of the true covariance matrix in case of multinormally distributed data. Consider the fault modeling described by (1) and (2), it follows that:…”
Section: Fault Amplitude Estimationmentioning
confidence: 99%
See 2 more Smart Citations
“…which is an unbiased estimate of the true covariance matrix in case of multinormally distributed data. Consider the fault modeling described by (1) and (2), it follows that:…”
Section: Fault Amplitude Estimationmentioning
confidence: 99%
“…The derivation of ψ −1 (y) denoted Z(y) = ψ −1 (y) ′ is : Z(y) = 4a 1 a 2 2 y 4 + 2(a 2 1 a 2 + aa 2 2 )y 3 + 3aa 1 a 2 y 2 + 2aa 2 1 y a(a + a 1 y + a 2 y 2 ) 2 .…”
Section: Probability Density Function Of the Fault Amplitude Estimatementioning
confidence: 99%
See 1 more Smart Citation
“…One possible treatment is to combine multiple charts to take care shifts in all ranges. For example, applying Shewhart control limits to EWMA or CUSUM charts to detect both large and small shifts (Lucas (1982), Albin et al (1997), Chih-Min et al (2000), Reynolds and Stoumbos (2005)). …”
Section: Detecting Unknown or Mixed-range Shiftsmentioning
confidence: 99%
“…The front-end process includes wafer fabrication (WF) and wafer probing. During WF, various test structures are fabricated on a wafer to extract information on the process and device performance for yield management [1]. Once WF is completed, the wafer acceptance test (WAT) is conducted using these test structures to measure important process related parameters, such as contact resistance, threshold voltage and diode leakage current etc.…”
Section: Introductionmentioning
confidence: 99%