2007
DOI: 10.1016/j.mee.2007.05.055
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SiGe: An attractive material for post-CMOS processing of MEMS

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Cited by 15 publications
(6 citation statements)
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“…Such precise spatial control of the material properties opens a route for the fabrication of complex devices based on alloy microstructures such as graded-index optical waveguides and lens, metasurfaces, Bragg gratings, laterally modulated compositional heterostructures, full-spectrum solar cells, multispectral photodetectors, and graded-base transistors, for example. The unexposed material and solute-poor undercladdings surrounding the laser-written regions can be selectively etched to release solute-rich microstripes of nanometer thickness (see Supporting Information, Figure S11), which could be used for the development of microbolometers, thermoelectric generators, and micro-electromechanical systems, where suspended microstructures are required for thermal isolation from the substrate or to allow for movement of parts . Furthermore, this laser-writing procedure could be applied to other multicomponent material systems, including epitaxially-grown crystalline SiGe films, metal alloys (Ni–Cu, Sb–Bi), ternary semiconductors (Al 1– x Ga x As, Hg 1– x Cd x Te, Cd 1– x Zn x Te), ceramics (Al 2 O 3 –Cr 2 O 3 , V 2 O 3 –Cr 2 O 3 ), and organic crystals ( p -chlorobromobenzene– p -dibromobenzene), which behave as pseudobinary systems, having isomorphous phase diagrams similar to that of SiGe alloys …”
Section: Resultsmentioning
confidence: 99%
“…Such precise spatial control of the material properties opens a route for the fabrication of complex devices based on alloy microstructures such as graded-index optical waveguides and lens, metasurfaces, Bragg gratings, laterally modulated compositional heterostructures, full-spectrum solar cells, multispectral photodetectors, and graded-base transistors, for example. The unexposed material and solute-poor undercladdings surrounding the laser-written regions can be selectively etched to release solute-rich microstripes of nanometer thickness (see Supporting Information, Figure S11), which could be used for the development of microbolometers, thermoelectric generators, and micro-electromechanical systems, where suspended microstructures are required for thermal isolation from the substrate or to allow for movement of parts . Furthermore, this laser-writing procedure could be applied to other multicomponent material systems, including epitaxially-grown crystalline SiGe films, metal alloys (Ni–Cu, Sb–Bi), ternary semiconductors (Al 1– x Ga x As, Hg 1– x Cd x Te, Cd 1– x Zn x Te), ceramics (Al 2 O 3 –Cr 2 O 3 , V 2 O 3 –Cr 2 O 3 ), and organic crystals ( p -chlorobromobenzene– p -dibromobenzene), which behave as pseudobinary systems, having isomorphous phase diagrams similar to that of SiGe alloys …”
Section: Resultsmentioning
confidence: 99%
“…GILD combines the Laser Thermal Processing technique [5][6][7] with the incorporation of Ge atoms from a precursor gas chemisorbed on the surface sample. The processing technique uses a XeCl excimer laser whose 20 ns pulses at 308 nm are strongly absorbed over a depth of about 7 to 10 nm in Si, Ge and SiGe.…”
Section: Methodsmentioning
confidence: 99%
“…Many researchers have performed studies comparing the effect of thermal and laser annealing on the properties of silicon alloys (Parr et al 2002;Sedky 2007). These studies reported laser/annealed films to have better device properties than thermal annealed.…”
Section: Introductionmentioning
confidence: 99%