2011 IEEE Bipolar/BiCMOS Circuits and Technology Meeting 2011
DOI: 10.1109/bctm.2011.6082751
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SiGe:C HBT architecture with epitaxial external base

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Cited by 24 publications
(22 citation statements)
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“…By the help of non-standard technology elements the feasibility of f max values around 500 GHz could be shown [6]- [9]. The recently proposed SEG HBT process in which an epitaxial base link (EBL) is formed after emitter fabrication [7] offers a potential way to overcome limitations of the classical DPSA technology in forming a more conductive baselink suitable for ongoing lateral scaling. However, a reliable estimation of the performance advantage of the EBL HBT with respect to the standard DPSA approach was not possible so far due to the use of different collector constructions and different transistor topologies in the respective technologies.…”
Section: Introductionmentioning
confidence: 99%
“…By the help of non-standard technology elements the feasibility of f max values around 500 GHz could be shown [6]- [9]. The recently proposed SEG HBT process in which an epitaxial base link (EBL) is formed after emitter fabrication [7] offers a potential way to overcome limitations of the classical DPSA technology in forming a more conductive baselink suitable for ongoing lateral scaling. However, a reliable estimation of the performance advantage of the EBL HBT with respect to the standard DPSA approach was not possible so far due to the use of different collector constructions and different transistor topologies in the respective technologies.…”
Section: Introductionmentioning
confidence: 99%
“…The goal of this letter is to show the outstanding performance of SiGe HBTs. Through an optimization of process and circuit layout, τ gate was reduced from 2.72 ps [9] to 1.65 ps that is significantly lower than the previously reported value of 1.9 ps [10]. The RO architecture of this letter is similar to [9], [10].…”
Section: Introductionmentioning
confidence: 64%
“…Through an optimization of process and circuit layout, τ gate was reduced from 2.72 ps [9] to 1.65 ps that is significantly lower than the previously reported value of 1.9 ps [10]. The RO architecture of this letter is similar to [9], [10]. Process technology and device performance are presented in Section II, followed by the RO circuit description in Section III.…”
Section: Introductionmentioning
confidence: 94%
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