Signal integrity: Efficient, physics-based via modeling: Integration of striplines

Rimolo-Donadío, Renato; Selli, G.; Paulis, Francesco de; Gu, Xiaoxiong; Kwark, Young; Drewniak, James L.; Bruens, H-D; Schuster, Christian

doi:10.1109/memc.2012.6244976

Cited by 10 publications

(2 citation statements)

References 17 publications

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“…The design of signal via structures is more complex compared to traces. In multilayer boards, when current passes through the via, a parallel plate mode occurs between the reference planes [2][3][4], leading to the excitation of electromagnetic waves and resonance phenomena [5]. By adding ground vias around the signal via, resonance can be effectively suppressed [6].…”

Section: Introductionmentioning

confidence: 99%

Design of high-frequency test fixture considering impedance matching

Peng,

Cai,

Yang

et al. 2024

International Conference on Mechatronic Engineering and Artificial Intelligence (MEAI 2023)

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This paper presents the design of a high-frequency test fixture for high-speed connectors. Specifically, after analyzing and designing the board material, laminate structure, trace structure, and signal via structure, the impedance consistency and bandwidth of the high-speed interconnect structure are verified through TDR and S-parameter simulations conducted in HFSS. a PCB layout is generated using Cadence. The test results confirm that the differential impedance of the fixture meets the requirements for high-speed connector testing. Within the frequency range of 0-30 GHz, the difference between S11 and S21 for the 2x-thru structure is greater than 0 dB, indicating a bandwidth capability of up to 30 GHz for the fixture.

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Section: Introductionmentioning

confidence: 99%

Design of high-frequency test fixture considering impedance matching

Peng,

Cai,

Yang

et al. 2024

International Conference on Mechatronic Engineering and Artificial Intelligence (MEAI 2023)

View full text Add to dashboard Cite

show abstract

“…They provided the return current paths between ground plane pairs; studies had found that the insertion loss of the signal could be improved by these ground vias. In the discussion of [13], six ground vias were placed near the signal via to eliminate the via-plane coupling, and a physics-based equivalent circuit modeling approach [14,15] was introduced for the ancillary study. Those studies were based on the theoretical model at a low frequency band.…”

Section: Introductionmentioning

confidence: 99%

A Novel Microstrip-to-Microstrip Vertical Via Transition in X-Band Multilayer Packages

2016

International Journal of Antennas and Propagation

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This paper investigates a novel X-band microstrip-to-microstrip vertical via transition with matching pads loaded signal via. This design has been proposed for a multilayer substrate package. The matching pads, which are located in the center of the signal via on each ground layer, are adopted to further improve the impedance matching level and thus attain better signal transition performance. A physics-based equivalent circuit modeling approach has been employed for this research. The right angle MS-to-MS via transition was also designed using this technique. The simulatedS-parameters indicate that the match-pad design made a breakthrough in achieving an approximate −15 dB wide-band return loss reduction. The measuredS-parameter of MS-to-MS transition showed that return loss with the matching pads is better than that without the matching pads.

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