No abstract

A new approach is proposed for modeling electromagnetic emissions of a printed circuit board (PCB) based on amplitude-only near-field measurement data. Magnetic dipoles placed over the top layer of the PCB are introduced as the equivalent of actual radiated sources. A restarted optimization procedure based on a differential evolution algorithm is developed to determine the parameters of the dipoles (number, position, and moment components) via minimizing the difference between the measured magnetic near field and that radiated by the dipoles. These equivalent dipoles can be used to predict the radiated emissions of the PCB once being determined. The proposed approach does not need the phase of the measured near fields, and its computational complexity is very low. Numerical results are presented to demonstrate the validity and efficiency of the proposed approach.

The trend of increasing digital system performance by downscaling the device size poses daunting challenges in system design due to the increased power density, higher I/O count, interconnect bandwidth, and timing closure requirements. Silicon carrier with Through Silicon Vias (TSVs) or TSI technology is identified as a system and packaging level solution to overcome all those challenges. In this paper we describe the key electrical elements in a typical TSI digital system and discuss their impact on overall system performance. We also discuss the system level power integrity analysis for TSI as its power delivery is one of the major engineering challenges.