1994
DOI: 10.1557/proc-342-255
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Silicon-Carbon Random Alloy Epitaxy on Silicon by Rapid Thermal Chemical Vapor Deposition

Abstract: We have grown dilute Si-C epitaxial layers on Si (100) substrates at 800°C with a RTCVD process using SiH4 and C3H8. C atoms can be kinetically stabilized in interstitial sites in the Si lattice at relatively high temperatures if process parameters, such as growth rate and C/Si flux ratio, are optimized.

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Cited by 4 publications
(4 citation statements)
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“…14͒ and 0.002 for C 3 H 8 . 13 A value of 0.51 was reached for CH 4 , albeit with PECVD. 6 Since in our case the growth temperature is below 650°C and our experimental value of is much higher, this reaction scheme can be excluded.…”
Section: Discussionmentioning
confidence: 94%
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“…14͒ and 0.002 for C 3 H 8 . 13 A value of 0.51 was reached for CH 4 , albeit with PECVD. 6 Since in our case the growth temperature is below 650°C and our experimental value of is much higher, this reaction scheme can be excluded.…”
Section: Discussionmentioning
confidence: 94%
“…n-type ͑100͒-Si substrates in a commercial RTCVD reactor ͑Jipelec, Jetlight 200͒ which was described in Ref. 13. The base pressure was a few 10 Ϫ7 Torr.…”
Section: Methodsmentioning
confidence: 99%
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“…In the last decade, different hydrocarbon gases i.e. CH 4 , C 2 H 4 and C 3 H 8 were used as precursor for carbon-doping in CVD technique but none of these gases could provide high quality SiGeC layers [10][11][12]. This was realized due to existence of C-C bonds which required a high decomposition temperatures and in fact it makes impossible to grow strained SiGeC layers in metastable region.…”
Section: Resultsmentioning
confidence: 99%