Silicon Micro-probe Card Using Porous Silicon Micromachining Technology

Kim, Young-Min Kim; Yoon, Hocheol; Lee, Jong-Hyun Lee

doi:10.4218/etrij.05.0104.0080

Cited by 21 publications

(13 citation statements)

References 9 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Probe cards are widely classified into cantilever needle type (Tada et al 1990), vertical needle type (Sasho and Sakata 1996;Boehm 2006) and microelectro-mechanical system (MEMS) type (Petersen et al 2004;Kim et al 2005;Wang et al 2008;Kim and Kim 2008), depending on shape and manufacturing method of probes. Needle type probe card is the most common type, and its design and fabrication are easier than MEMS probe card.…”

Section: Introductionmentioning

confidence: 99%

A MEMS guide plate for a high temperature testing of a wafer level packaged die wafer

Choi¹,

Ryu

2010

Microsyst Technol

View full text Add to dashboard Cite

This paper describes the design and fabrication of a MEMS guide plate, which was used for a vertical probe card to test a wafer level packaged die wafer. The size of the fabricated MEMS guide plate was 10.6 9 10.6 cm. The MEMS guide plate consisted of 8,192 holes to insert pogo pins, and four holes for bolting between the guide plate and the housing. To insert pogo pins easily, an inclined plane was defined at the back of each hole. Pitch and diameter of the hole were 650 and 260 lm, respectively. In order to define inserting holes and inclined planes at an exact position, silicon MEMS technology was used such as anisotropic etching, deep reactive etching and more. Silicon was used as the material of the guide plate to reduce alignment mismatch between the pogo pins and solder bumps during a high temperature testing. A combined probe card with the fabricated MEMS guide plate showed good x-y alignment and planarity errors within ±9 and ±10 lm at room temperature, respectively. In addition, x-y alignment and planarity are ±20 and ±16 lm at 125°C, respectively. The proposed MEMS guide plate can be applied to a vertical probe card for burn-in testing of a wafer level packaged die wafer because the thermal expansion coefficient of the MEMS guide plate and die wafer is same.

show abstract

Section: Introductionmentioning

confidence: 99%

A MEMS guide plate for a high temperature testing of a wafer level packaged die wafer

Choi¹,

Ryu

2010

Microsyst Technol

View full text Add to dashboard Cite

show abstract

“…In addition, the probes and guide block used in the 1.5G probe card are made by a micromachining technology. The nickel (Ni) alloy probes used in the 2G probe card are fabricated using a micro electro-mechanical system (MEMS) batch process which can produce probes in various shapes (Kim and Kim 2008;Wang et al 2006;Stephens et al 2001;Kim et al 2005;Zhang et al 1999;Mazza et al 1996). Ni alloy probes can be arranged a great deal within a relatively narrow area, because they can reduce their width and length compared to conventional tungsten probe.…”

Section: Introductionmentioning

confidence: 99%

Fabrication of a guide block for measuring a device with fine pitch area-arrayed solder bumps

Choi

Ryu

2012

Microsyst Technol

View full text Add to dashboard Cite

This paper describes the design and fabrication of a guide block and micro probes, which were used for a vertical probe card to test a chip with area-arrayed solder bumps. The size of the fabricated guide block was 10 mm 9 6 mm. The guide block consisted of 172 holes to insert micro probes, 2 guide holes for exact alignment, and 4 holes for bolting between the guide block and the housing of a PCB. Pitch and size of the inserting holes were 80 lm, and 90 lm 9 30 lm, respectively. A silicon on insulator wafer was used as the substrate of the guide block to reduce micro probes insertion error. The micro probes were made of nickel-cobalt (Ni-Co) alloy using an electroplating method. The length and thickness of the micro probes were 910 and 20 lm, respectively. A vertical probe card assembled with the fabricated guide block and micro probes showed good x-y alignment and planarity errors within ±4 and ±3 lm, respectively. In addition, average leakage current and contact resistance were approximately 0.35 nA and 0.378 ohm, respectively. The proposed guide block and micro probes can be applied to a vertical probe card to test a chip with area-arrayed solder bumps.

show abstract

“…Microprobes can be fabricated using several manufacturing processes, which create small silicon and metal mechanical structures (Kim et al 2005;Park et al 2002;Liao and Chen 2005). There are two main approaches for fabricating micro cantilevers and vertical probes.…”

Section: Introductionmentioning

confidence: 99%

New fabrication method for micro-pyramidal vertical probe array for probe cards

et al. 2009

View full text Add to dashboard Cite

This paper presents a novel, precision process for fabricating a micro metal vertical probe array with various tip angles. The fabrication process includes an inclined and multiple-exposure in ultraviolet (UV) lithographic and Ni electroforming technology. Because of the light passing through an optical transparent homogenous material, the materials' refractive index results in light path deflection. By changing the photomask and workpiece inclination, controllable various tip angles can be fabricated. The experimental results showed that micro metal vertical probes with 54A degrees, 60A degrees and 68A degrees tip angles are achieved. The micro-pyramidal vertical probe array can be used in vertical-type probe cards without the conventional complicated assembly

show abstract

Silicon Micro-probe Card Using Porous Silicon Micromachining Technology

Cited by 21 publications

References 9 publications

A MEMS guide plate for a high temperature testing of a wafer level packaged die wafer

A MEMS guide plate for a high temperature testing of a wafer level packaged die wafer

Fabrication of a guide block for measuring a device with fine pitch area-arrayed solder bumps

New fabrication method for micro-pyramidal vertical probe array for probe cards

Contact Info

Product

Resources

About