“…Hydrogen-silicon bonds formed in the hydrogen anneal should reduce dislocation mobility and thereby hinder motion of dislocations to the Si surface. Oxide loss in the H 2 anneal [7], if laterally non-uniform, could cause bending of the crystal overlayer.…”
Silicon wafers, implanted with oxygen at 550°C to form a buried oxide layer have been examined with TEM and x-ray diffraction. Implantation damage increased with depth up to -1500 ~ where some amorphous regions were seen.
“…Hydrogen-silicon bonds formed in the hydrogen anneal should reduce dislocation mobility and thereby hinder motion of dislocations to the Si surface. Oxide loss in the H 2 anneal [7], if laterally non-uniform, could cause bending of the crystal overlayer.…”
Silicon wafers, implanted with oxygen at 550°C to form a buried oxide layer have been examined with TEM and x-ray diffraction. Implantation damage increased with depth up to -1500 ~ where some amorphous regions were seen.
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