Silicon Photonics 2012
DOI: 10.1002/9781119945161.ch8
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Silicon Photodetectors

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Cited by 32 publications
(1 citation statement)
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“…For these new systems in the More-than-Moore ITRS (International Technology Roadmap of Semiconductors) [1] scenario, diverse materials including silicon (Si) [2], silicon dioxide (SiO 2 ) [3] and Pyrex glass [4] are commonly used for the assembly of integrated heterogeneous systems. For example, the heterogeneous integration of silicon-based electronics with photonics components [5,6], MEMS components such as electrokinetic pumps or cell processing modules, polymerbased filtration systems [7,8], and silicon-or polymer-based sensors with microfabricated reference electrodes [7,9,10], all require the bonding of one substrate to another. Examples of commonly-used substrates include silicon, silicon dioxide or glass, on which the electronics, photonics, MEMS or fluidic components or modules are fabricated and subsequently integrated to create lab-on-chip sensing [7] or imaging [11] systems.…”
Section: Introductionmentioning
confidence: 99%
“…For these new systems in the More-than-Moore ITRS (International Technology Roadmap of Semiconductors) [1] scenario, diverse materials including silicon (Si) [2], silicon dioxide (SiO 2 ) [3] and Pyrex glass [4] are commonly used for the assembly of integrated heterogeneous systems. For example, the heterogeneous integration of silicon-based electronics with photonics components [5,6], MEMS components such as electrokinetic pumps or cell processing modules, polymerbased filtration systems [7,8], and silicon-or polymer-based sensors with microfabricated reference electrodes [7,9,10], all require the bonding of one substrate to another. Examples of commonly-used substrates include silicon, silicon dioxide or glass, on which the electronics, photonics, MEMS or fluidic components or modules are fabricated and subsequently integrated to create lab-on-chip sensing [7] or imaging [11] systems.…”
Section: Introductionmentioning
confidence: 99%