Simple Removal Technology of Chemically Stable Polymer in MEMS Using Ozone Solution

Yoshida, Shinya; Yanagida, H.; Esashi, Masayoshi; Tanaka, Shuji

doi:10.1109/jmems.2012.2217374

Cited by 9 publications

(3 citation statements)

References 22 publications

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“…There are various debonding methods to remove the carrier wafer as polymer etching, sacrificial layer etching and etching or mechanical grinding of the carrier wafer. In order to remove the polymer used for the wafer bonding polymer etching by ozone in acetic acid was developed [18]. Figure 9 Probe array for AFM based data storage [4,12].…”

Section: Discussionmentioning

confidence: 99%

Heterogeneous integration by adhesive bonding

Esashi

Tanaka

2013

Micro Nano Syst Lett

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Wafer level adhesive bonding has been applied for the fabrication of micro systems which have heterogeneous components on LSI. Films or MEMS devices formed on a carrier wafer are transferred on a LSI wafer, which makes versatile heterogeneous integration possible. Film transfer processes and device transfer processes have been developed and applied to mirror array, resonator, piezoelectric switch, IR imager, tactile sensor, electron source and so on. Selective bonding to transfer devices on one carrier wafer to multiple LSI wafers has been developed.

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Section: Discussionmentioning

confidence: 99%

Heterogeneous integration by adhesive bonding

Esashi

Tanaka

2013

Micro Nano Syst Lett

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“…Finally, the sacrificial layer is removed by O 2 plasma ashing or O 3 water etching to release the bridge structures. 24) 4. Results…”

Section: Designmentioning

confidence: 99%

Tunable Surface Acoustic Wave Filter Using Integrated Micro-Electro-Mechanical-System Based Varactors Made of Electroplated Gold

Konno

Hirano

Inaba

et al. 2013

Jpn. J. Appl. Phys.

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This paper describes the fabrication and preliminary evaluation of a 200 Ω terminated, 1 GHz tunable surface acoustic wave (SAW) filter with electrostatic micro-electro-mechanical-system (MEMS) varactors. The tunable filter was constructed on a 15° Y LiNbO3 substrate to use Love wave with an electromechanical coupling coefficient as high as 25%. The bridge structure of the MEMS varactor was fabricated by Au electroplating on a sacrificial photoresist, which was finally removed by either O2 plasma ashing or O3 water etching. The measured center frequency was 1.07 GHz, and the bandwidth was 171 MHz, i.e., 16% in relative bandwidth. The MEMS varactor, which was connected to a series SAW resonator in parallel, pulled in by an actuation voltage of 150 V DC, and the right passband edge moved to lower frequency side by 15 MHz.

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“…high-speed, complete, non-swelling, selective, safe and environmentally-friendly removal technology is desirable. As a candidate for the ideal removal technology, we have proposed to utilize ozone water [14]. The removal process using ozone water is relatively safe and environmentallyfriendly because ozone has the property of self-decomposition.…”

Section: Introductionmentioning

confidence: 99%

Development of UV-assisted ozone steam etching and investigation of its usability for SU-8 removal

Yoshida¹,

Esashi²,

Tanaka³

2014

J. Micromech. Microeng.

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We have developed ultraviolet (UV)-assisted ozone steam etching as a novel SU-8 removal technology. This technology is expected to remove SU-8 at a higher etch rate compared to a conventional wafer cleaning process based on ozone water immersion. An etching apparatus prototyped in this study achieves an etch rate greater than 100 nm min−1 by intermittently rotating an SU-8-coated substrate on a spinner for spinning out the etching products under UV irradiation. Its complete removability is also verified by analyzing the surfaces of etched samples via scanning electron microscopy and x-ray photoelectron spectroscopy. In a micromolding process, the non-swelling removability is successfully demonstrated by removing a SU-8 sacrificial mold and leaving electroplated metal mushroom microstructures without destruction. Such a structure cannot be released by conventional resist strippers, because it is lifted up due to resist swelling. We believe this etching technology becomes a viable option to remove chemically-stable polymers such as SU-8 in microelectromechanical systems.

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Simple Removal Technology of Chemically Stable Polymer in MEMS Using Ozone Solution

Cited by 9 publications

References 22 publications

Heterogeneous integration by adhesive bonding

Heterogeneous integration by adhesive bonding

Tunable Surface Acoustic Wave Filter Using Integrated Micro-Electro-Mechanical-System Based Varactors Made of Electroplated Gold

Development of UV-assisted ozone steam etching and investigation of its usability for SU-8 removal

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