Simulation, modeling, and testing embedded RF capacitors in low temperature cofired ceramic

Blood, W.; Ling, Feng; Kamgaing, Telesphor; Myers, T. H.; Petras, M.

doi:10.1109/ectc.2001.927890

Cited by 15 publications

(2 citation statements)

References 4 publications

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“…Numerous methods for determining the highfrequency dielectric properties of functional materials were presented in the literature (e.g., Z -shrinkage [13,[25][26][27]). For the particular investigation of interest in this work, the capacitor evaluation method was used [28].…”

Section: Rf and Microwave Test And Evaluationmentioning

confidence: 99%

Tunability, Frequency and Temperature Behavior of Cofired LTCC-Integrated Barium-Strontium-Titanate up to 8 GHz

Rentsch

Müller

Hein

2012

Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT)

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A new approach towards embedding barium-strontium-titanate (BST) patches into a commercial low temperature co-fired ceramic (LTCC) is described, using a tape transfer technique. Pressure-assisted sintering is successfully employed to achieve flat multi-layer multi-material modules without internal cracks or delaminations. Beside the description of the processing technology, the paper presents also a specific procedure of determining the microwave properties of embedded thick BST films, which is based on using the experimental evaluation of a shunt capacitor. The permittivity of the embedded BST determined at room temperature is about 214 and remains constant at least from 100 MHz up to 8 GHz. In addition, the effects of temperature and bias voltages on the microwave properties of LTCC BST were studied systematically from 1 MHz up to 8 GHz. We observed a tuning of the permittivity by about −49 %, either by raising the temperature from 21°C to 125°C, or by applying a bias electrical field of up to 10 V/μm. Additionally, breakdown voltages were investigated. The embedded BST withstands field strengths of more than 20 V/μm under laboratory conditions.

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Section: Rf and Microwave Test And Evaluationmentioning

confidence: 99%

Tunability, Frequency and Temperature Behavior of Cofired LTCC-Integrated Barium-Strontium-Titanate up to 8 GHz

Rentsch

Müller

Hein

2012

Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT)

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show abstract

“…SOP technologies used several substrates. So far, LTCC has been widely studied for SOP applications, since LTCC materials have low loss tangent, which it allows to make high Q embedded passive components [2][3][4]. However, they are limited to mass production and low cost due to the small size and the shrinkage of the ceramic substrate occurred during the firing process.…”

Section: Introductionmentioning

confidence: 99%

Fabrication and Characterization of Fully Embedded Diplexer and Band-Pass Filters for Organic Rf Sop Applications

Lee

Park

2008

Integrated Ferroelectrics

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In this paper, fully embedded dual-band WLAN diplexer, 2.4 GHz WLAN BPF and wide-band pass filter are investigated into a multi-layered organic package substrate for low cost RF SOP (System on Package) applications. These embedded passive components were designed and analyzed by using ADS circuit simulator and CST 3D EM simulator for verifying their applicability. The fabricated diplexer and filters are the smallest one of the filters formed onto the organic substrate. The diplexer has a size of 3 mm × 2.5 mm × 0.77 mm and exhibits an insertion loss of max −0.68 dB in 2.4 ∼ 2.5 GHz band and max -3 dB in 5.15 ∼ 5.32 GHz band, respectively. The 2.4 GHz BPF has a size of 2.7 mm × 2.1 mm × 0.77 mm and exhibits an insertion loss of max −2.7 dB. The WBPF has a size of 3.2 mm × 2.5 mm × 0.77 mm and exhibits an insertion loss of −2.65 dB. The major benefit of these embedded passive components, compared to a discrete solution, is a significant simplification and size/volume reduction of RF systems design.

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Compact integrated combline band‐pass filter with interdigital capacitive loads using LTCC technology

Lim

Kim

2004

Micro & Optical Tech Letters

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COMPACT INTEGRATED COMBLINE BAND-PASS FILTER WITH INTERDIGITAL CAPACITIVE LOADS USING LTCC TECHNOLOGY. A lumped-element band-pass filter using embedded passives was proposed, but it has a relatively large size and a complicated structure [3]. The use of low-temperature co-fired ceramic (LTCC) material can be a good solution because it has outstanding mechanical and electrical properties and offers the possibility of integration of various passive elements. To achieve a compact embedded band-pass filter, this paper presents a new tapped-line combline filter with multilayer vertical interdigital capacitors. The combline structure has capacitive loads at the end of the resonator in order to reduce the physical length while extending the electrical length of the resonator and a tappedline arrangement offers size reduction and ease of interface with other circuit components. Moreover, a vertical interdigital capacitor further reduces the overall size of the filter than the use of conventional metal-insulator-metal (MIM)-type capacitor [4]. The proposed filter was fully integrated into a general LTCC substrate and has a very simple structure and a small size. DESIGNA combline filter consists of mutually coupled resonators which reduce physical length by less than a quarter-wavelength by loading capacitive loads. The proposed filter has an interdigital capacitor at the end of the resonator for realizing small size by employing the slow-wave effect. The basic design method of the combline filter (see Fig. 1) was fully described in [5]. To reduce the overall size, a shorter electrical length of the resonator was chosen, while a large value of loading capacitance was employed. The three-dimensional (3D) view of the proposed filter is shown in Figure 2(a). It uses the minimum number of poles (two), and a relatively large capacitance is obtained by employing multilayer vertical interdigital capacitors. By using interdigital-type capacitors, the 2D area required for large capacitance is easily reduced. The capacitor was modeled by extracted S-parameter data using a commercial EM simulation tool. The effective capacitance C eff was calculated by the following equation:whereThe design was accomplished using the above equations and tuned using a conventional EM simulation tool. MEASUREMENTFigure 2(b) shows a cross-sectional view of the integrated filter. The filter was fabricated using a conventional LTCC technology with Dupont 951 powder and 6142B silver paste. Figure 3 shows a photograph of this filter integrated in an LTCC substrate. The characteristics of the filter were measured using a Wiltron 360B network analyzer and Cascade microtech air coplanar-type 500-m pitch ground-signal-ground (G-S-G) probe tip. A TRL calibration method was used to calibrate the system. The fabricated filter has 1.8-dB insertion loss, 37.6-dB return loss, and 280-MHz bandwidth at the center frequency of 5.09 GHz, as shown in Figure 4. The overall size of the filter is 2.7 ϫ 2.03 ϫ 0.4 mm without input and output pads for the measurement. The mea...

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Simulation, modeling, and testing embedded RF capacitors in low temperature cofired ceramic

Cited by 15 publications

References 4 publications

Tunability, Frequency and Temperature Behavior of Cofired LTCC-Integrated Barium-Strontium-Titanate up to 8 GHz

Tunability, Frequency and Temperature Behavior of Cofired LTCC-Integrated Barium-Strontium-Titanate up to 8 GHz

Fabrication and Characterization of Fully Embedded Diplexer and Band-Pass Filters for Organic Rf Sop Applications

Compact integrated combline band‐pass filter with interdigital capacitive loads using LTCC technology

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